1 Safety Precaution 3 1.1. General guidelines 3 2 Warning 4 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices 4 2.2. Precaution of Laser Diode 5 2.3. Service caution based on legal restrictions 6 3 Service Navigation 7 3.1. Service Information 7 3.2. Caution for DivX 7 4 Specifications 8 5 New Feature 10 5.1. About DivX 10 6 Location of Controls and Components 15 7 Operation Instructions 17 7.1. Taking out the Disc from DVD-Drive Unit when the Disc cannot be ejected by OPEN/CLOSE button 17 8 Service Mode 18 8.1. Self-Diagnosis and Special Mode Setting 18 9 Service Fixture & Tools 27 10 Disassembly and Assembly Instructions 28 10.1. Disassembly Flow Chart 28 10.2. P.C.B. Positions 28 10.3. Top Case 29 10.4. Front Panel 29 10.5. SD Card P.C.B. 29 10.6. RAM/Digital P.C.B. Module 29 10.7. DV Jack P.C.B. 31 10.8. HDD 31 10.9. Rear Panel 32 10.10. Power P.C.B. 33 10.11. Main P.C.B. and Front (L) P.C.B. 34 10.12. Tuner P.C.B. 34 11 Measurements and Adjustments 35 11.1. Service Positions 35 11.2. Caution for Replacing Parts 39 11.3. Standard Inspection Specifications after Making Repairs 41 12 Block Diagram 43 12.1. Power Supply Block Diagram 43 12.2. Analog Video Block Diagram 45 12.3. Analog Audio Block Diagram 46 12.4. Analog Timer Block Diagram 47 13 Schematic Diagram 49 13.1. Interconnection Schematic Diagram 49 13.2. Power Supply Schematic Diagram 50 13.3. Main Net (1/4) Section (Main P.C.B. (1/4)) Schematic Diagram (M) 51 13.4. Main Net (2/4) Section (Main P.C.B. (1/4)) Schematic Diagram (M) 52 13.5. Main Net (3/4) Section (Main P.C.B. (1/4)) Schematic Diagram (M) 53 13.6. Main Net (4/4) Section (Main P.C.B. (1/4)) Schematic Diagram (M) 54 13.7. A/V I/O (1/4) Section (Main P.C.B. (2/4)) Schematic Diagram (AV) 56 13.8. A/V I/O (2/4) Section (Main P.C.B. (2/4)) Schematic Diagram (AV) 57 13.9. A/V I/O (3/4) Section (Main P.C.B. (2/4)) Schematic Diagram (AV) 58 13.10. A/V I/O (4/4) Section (Main P.C.B. (2/4)) Schematic Diagram (AV) 59 13.11. Nicam Decoder Section (Main P.C.B. (3/4)) Schematic Diagram (DE) 61 13.12. Timer (1/4) Section (Main P.C.B. (4/4)) Schematic Diagram (T) 62 13.13. Timer (2/4) Section (Main P.C.B. (4/4)) Schematic Diagram (T) 63 13.14. Timer (3/4) Section (Main P.C.B. (4/4)) Schematic Diagram (T) 64 13.15. Timer (4/4) Section (Main P.C.B. (4/4)) Schematic Diagram (T) 65 13.16. Tuner Pack Schematic Diagram 66 13.17. SD Card Schematic Diagram 67 13.18. Front (L) Schematic Diagram 68 13.19. DV Jack Schematic Diagram 68 14 Printed Circuit Board 69 14.1. Power P.C.B. 69 14.2. Main P.C.B. 70 14.3. Tuner P.C.B. and DV Jack P.C.B. 75 14.4. SD Card P.C.B. and Front (L) P.C.B. 76 15 Appendix for Schematic Diagram 77 15.1. Voltage and Waveform Chart 77 16 Parts and Exploded Views 83 16.1. Exploded Views 83 16.2. Replacement Parts List 85 CONTENTS Page Page 2 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
1.1.1. Leakage current cold check 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be . Figure 1 1.1.2. Leakage current hot check (See Figure 1 .) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliampere. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. 1 Safety Precaution 1.1. General guidelines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards. 3 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
2 Warning 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device). 4 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
2.2. Precaution of Laser Diode 5 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
2.3. Service caution based on legal restrictions 2.3.1. General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees C (662±86°F). Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available through the service parts route. RFKZ03D01K-----------(0.3mm 100g Reel) RFKZ06D01K-----------(0.6mm 100g Reel) RFKZ10D01K-----------(1.0mm 100g Reel) Note * Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3% 6 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
3 Service Navigation 3.1. Service Information 3.2. Caution for DivX 7 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
5.1.2. Operating Instructions about DivX Video-on-Demand Content DivX Video-on-Demand (VOD) content is encrypted for copyright protection. In order to play DivX VOD content on this unit, you first need to register the unit. Follow the on line instructions for purchasing DivX VOD content to enter unit´s registration code and register unit. Visit www.divx.com/vod for more information. Display unit´s registration code. 5 New Feature 5.1. About DivX 5.1.1. General DivX is a new video compressing format that is applied MPEG4 technology to improve image quality and the compressibility, and it is developed by the DivXNetworks, Inc., Video file of high resolution and the high picture quality can be made though it is a high compressibility. DivX codec is necessary for converting video to DivX file and .playback files made. 10 DMR-EH55EC / DMR-EH55EP / DMR-EH56EG Downloaded from www.Manualslib.com manuals search engine
Are you experiencing issues with your Panasonic DMR-EH55 DVD Recorder? Why spend money on repairs or replacements when you can easily handle it yourself?
This comprehensive service and repair manual is utilized by Official Certified Panasonic Technicians and is designed to assist you in troubleshooting and repairing your DVD Recorder.
With this manual, you will gain valuable insights into safety precautions, product specifications, disassembly and reassembly procedures, adjustments, maintenance, troubleshooting techniques, schematic and block diagrams, as well as a replacement parts list.
The manual covers the following models:
Panasonic DMR-EH55EE
Panasonic DMR-EH55GC
Panasonic DMR-EH55GCS
Panasonic DMR-EH55GN
Panasonic DMR-EH55EC
Panasonic DMR-EH55EP
Panasonic DMR-EH56EG
This detailed manual is enriched with illustrations, photographs, and step-by-step instructions to facilitate the repair and servicing of your device.
It's important to note that this is the official service and repair manual in PDF format, ensuring the highest resolution for quality printing.
Upon payment, you will gain instant access to the manual, eliminating shipping fees and delivery wait times, allowing you to commence repairs promptly.
Specifications:
Language: English
Pages: 92
Platform: Windows and MAC
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Panasonic DMR-EH55 Series Service Manual & Repair Guide