Sony Cyber Shot DSC-W630 Service Manual & Repair Guide

SERVICE MANUAL DSC-W630_L3 LEVEL 3 Check the SERVICE NOTE (LEVEL 2) before the service. Revision History Published by Sony Techno Create Corporation Sony Corporation 983462811.pdf Ver. 1.0 2011.12 DIGITAL STILL CAMERA The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. DSC-W630 9-834-628-11 US Model Canadian Model AEP Model UK Model E Model Australian Model Hong Kong Model Chinese Model Korea Model Brazilian Model Japanese Model Tourist Model Photo: Silver Ver. Date History Contents S.M. Rev. issued 1.0 2011.12 Official Release — — 2011L08-1 © 2011.12

– 2 – DSC-W630_L3 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO- NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM- PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. Caution Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type. Dispose of used batteries according to the instructions. 注意電池の交換は，正しく行わないと破裂する恐れがあります。電池を交換する場合には必ず同じ型名の電池又は同等品と交換してください。使用済み電池は，取扱指示に従って処分してください。 SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer. 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are “pinched” or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. 5. Check the B+ voltage to see it is at the values specified. 6. Flexible Circuit Board Repairing • Set the soldering iron tip temperature to 350 °C approximately. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. 1. 注意事項をお守りください。サービスのとき特に注意を要する個所については，キャビネット，シャーシ，部品などにラベルや捺印で注意事項を表示しています。これらの注意書き及び取扱説明書等の注意事項を必ずお守り下さい。 2. 指定部品のご使用をセットの部品は難燃性や耐電圧など安全上の特性を持ったものとなっています。従って交換部品は，使用されていたものと同じ特性の部品を使用して下さい。特に回路図，部品表に0印で指定されている安全上重要な部品は必ず指定のものをご使用下さい。 3. 部品の取付けや配線の引きまわしはもとどおりに安全上，チューブやテープなどの絶縁材料を使用したり，プリント基板から浮かして取付けた部品があります。また内部配線は引きまわしやクランパによって発熱部品や高圧部品に接近しないよう配慮されていますので，これらは必ずもとどおりにして下さい。 4. サービス後は安全点検をサービスのために取外したネジ，部品，配線がもとどおりになっているか，またサービスした個所の周辺を劣化させてしまったところがないかなどを点検し，安全性が確保されていることを確認して下さい。 5. チップ部品交換時の注意・取外した部品は再使用しないで下さい。・タンタルコンデンサのマイナス側は熱に弱いため交換時は注意して下さい。 6. フレキシブルプリント基板の取扱いについて・半田こてのこて先温度は約350℃に設定してください。・同一パターンに何度もコテ先を当てないで下さい。（3回以内）・パターンに力が加わらないよう注意して下さい。サービス，点検時には次のことにご注意ください。 – ENGLISH – – JAPANESE – UNLEADED SOLDER This unit uses unleaded solder. Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Be careful to the following points to solder or unsolder. • Set the soldering iron tip temperature to 350 °C approximately. If cannot control temperature, solder/unsolder at high temperature for a short time. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Be sure to control soldering iron tips used for unleaded solder and those for leaded solder so they are managed separately. Mixing unleaded solder and leaded solder will cause detachment phenomenon. 無鉛半田について本機には無鉛半田が使用されています。無鉛半田を使用している基板には，無鉛（Lead Free）を意味するレッドフリーマークがプリントされています。（注意：基板サイズによっては，無鉛半田を使用していてもレッドフリーマークがプリントされていないものがあります）：レッドフリーマーク無鉛半田は，下記の点に注意して使用してください。・半田こてのこて先温度は約350℃に設定してください。温度調節が無理な場合は，高温短時間で作業を行ってください。注意：半田こてを長く当てすぎると，基板のパターン（銅箔）がはがれてしまうことがありますので，注意してください。また，従来の半田よりも粘性が強いため， IC端子などが半田ブリッジしないように注意してください。・半田こてのこて先は，必ず無鉛半田用と有鉛半田用に分けて管理してください。無鉛半田と有鉛半田が混在すると剥離現象が発生してしまいます。

DSC-W630_L3 2-1 Ref. No. Part No. Description Ref. No. Part No. Description 2. REPAIR PARTS LIST (ENGLISH) NOTE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom re- quired for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • CAPACITORS: uF: μF • COILS uH: μH • RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable • SEMICONDUCTORS In each case, u: μ, for example: uA...: μA... , uPA... , μPA... , uPB... , μPB... , uPC... , μPC... , uPD..., μPD... When indicating parts by reference number, please include the board name. The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. Caution Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type. Dispose of used batteries according to the instructions. Note: Be sure to read “Precautions for Replacement of Imager” on page 6-1. (JAPANESE) 【使用上の注意】 • ここに記載されている部品は, 補修用部品であるため, 回路図及びセットに付いている部品と異なる場合があります。 • -XX, -Xは標準化部品のため, セットに付いている部品と異なる場合があります。 • *印の部品は常備在庫しておりません。 • コンデンサの単位でuFはμFを示します。 • 抵抗の単位Ωは省略してあります。金　　被：金属被膜抵抗。サンキン：酸化金属被膜抵抗。 • インダクタの単位でuHはμHを示します。 • 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ μA..., μPA..., μPB..., μPC..., μPD...を示します。図面番号で部品を指定するときは基板名又はブロックを併せて指定してください。お願い 0印の部品，または0印付の点線で囲まれた部品は，安全性を維持するために，重要な部品です。従って交換時は，必ず指定の部品を使用してください。注意電池の交換は，正しく行わないと破裂する恐れがあります。電池を交換する場合には必ず同じ型名の電池又は同等品と交換してください。使用済み電池は，取扱指示に従って処分してください。 Note: イメージャの交換時は6-1ページの“イメージャ交換時の注意”を必ずお読みください。 A-1856-272-A CD-837 FLEXIBLE BOARD, COMPLETE ****************************** (IC002 is not supplied, but this is included in CD-837 FLEXIBLE COMPLETE BOARD.) < CAPACITOR > C001 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C002 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C003 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C004 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C005 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C006 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C007 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C008 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V < IC > * IC001 8-753-327-70 IC CXA3841UR-T9 IC002 (Not supplied) IC ICX682SQL-13 < RESISTOR > R001 1-218-981-91 METAL CHIP 220K 5% 1/16W R002 1-218-980-11 METAL CHIP 180K 5% 1/16W R003 1-218-982-11 METAL CHIP 270K 5% 1/16W R004 1-218-981-91 METAL CHIP 220K 5% 1/16W 1-882-822-11 FPC-025 FLEXIBLE BOARD ********************* 1-883-782-11 FPC-029 FLEXIBLE BOARD ********************* 1-882-746-11 MA-472 FLEXIBLE BOARD ******************** A-1856-271-A RL-125 BOARD, COMPLETE ********************** (BT900 is not included in RL-125 FLEXIBLE BOARD.) < BATTERY> BT900 1-756-710-12 LITHIUM RECHARGEABLE BATTERY < CAPACITOR > C002 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C003 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V * C005 1-116-456-11 CERAMIC CHIP 0.047uF 10% 350V C008 1-100-761-21 CERAMIC CHIP 0.01uF 10% 250V < CONNECTOR > * CN001 1-819-659-81 CONNECTOR, FPC (ZIF) 23P CN002 1-820-634-51 CONNECTOR, FPC (LIF (NON-ZIF)) 10P < DIODE > * D003 6-503-638-01 DIODE RFU02VS6SGJTR * D004 6-503-001-01 DIODE RR255M-400FJTR D101 6-503-448-01 DIODE SML-L14DTAFS * D102 6-502-294-01 DIODE SML-D13M8WT86S < IC > IC001 6-716-806-01 IC R2J20071DNS < MICROPHONE > MIC001 1-542-777-51 MICROPHONE < TRANSISTOR > Q001 6-552-987-01 TRANSISTOR RJP4010AGE-01 < RESISTOR > R003 1-216-121-11 METAL CHIP 1M 5% 1/10W R005 1-218-935-11 METAL CHIP 33 5% 1/16W R006 1-216-097-11 METAL CHIP 100K 5% 1/10W R007 1-208-647-11 METAL CHIP 33 0.5% 1/16W R008 1-208-889-11 METAL CHIP 1.2K 0.5% 1/16W R009 1-218-871-11 METAL CHIP 10K 0.5% 1/10W R101 1-218-945-11 METAL CHIP 220 5% 1/16W R102 1-218-948-11 METAL CHIP 390 5% 1/16W < SWITCH > S101 1-798-408-11 TACTILE SWITCH, S102 1-786-914-31 SWITCH, TACTILE < TRANSFORMER > * T001 1-445-775-11 D.C.-D.C.CONVERTER TRANSFORMER A-1856-270-A SW-583 BOARD, COMPLETE ********************** < CONNECTOR > CN001 1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF)) 6P < COMPOSITION CIRCUIT BLOCK > RB001 1-234-378-21 RES, NETWORK 10K (1005X4) RB002 1-234-378-21 RES, NETWORK 10K (1005X4) RB003 1-234-378-21 RES, NETWORK 10K (1005X4) < SWITCH > S001 1-786-914-31 SWITCH, TACTILE S002 1-786-914-31 SWITCH, TACTILE S003 1-786-914-31 SWITCH, TACTILE S004 1-786-914-31 SWITCH, TACTILE S005 1-786-914-31 SWITCH, TACTILE S006 1-786-914-31 SWITCH, TACTILE S007 1-786-914-31 SWITCH, TACTILE S008 1-786-914-31 SWITCH, TACTILE S009 1-786-914-31 SWITCH, TACTILE * S010 1-786-947-11 SIGNAL SELECTOR SWITCH S011 1-786-914-31 SWITCH, TACTILE 2-2. ELECTRICAL PARTS LIST CD-837 FPC-025 FPC-029 MA-472 RL-125 SW-583

DSC-W630_L3 2-2 Ref. No. Part No. Description Ref. No. Part No. Description A-1861-539-A SY-309 BOARD, COMPLETE (SERVICE) ****************************** (IC2301, R301 and R402 are not supplied, but they are included in SY-309 COMPLETE BOARD (SERVICE).) < BATTERY TERMINAL > BH701 1-780-936-11 TERMINAL BOARD, BATTERY < CAPACITOR > C001 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C002 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C003 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C005 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C006 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C007 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C008 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C009 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C010 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C011 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C012 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C013 1-114-247-91 CERAMIC CHIP 270PF 10% 16V C014 1-114-419-21 CERAMIC CHIP 10uF 10% 16V C015 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C016 1-114-419-21 CERAMIC CHIP 10uF 10% 16V C017 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C018 1-100-591-91 CERAMIC CHIP 1uF 10% 25V C020 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C105 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C106 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C108 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C109 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C301 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C302 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C303 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V C304 1-100-756-91 CERAMIC CHIP 0.047uF 10% 50V C305 1-100-670-91 CERAMIC CHIP 4.7uF 20% 16V C306 1-100-591-91 CERAMIC CHIP 1uF 10% 25V C308 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C309 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C310 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C312 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C313 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C315 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C316 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C319 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C320 1-100-670-91 CERAMIC CHIP 4.7uF 20% 16V C321 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C322 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C323 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V C324 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C325 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C326 1-119-750-11 TANTAL. CHIP 22uF 20% 6.3V C327 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C331 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C332 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C333 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C401 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C402 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C403 1-114-273-91 TANTAL. CHIP 47uF 20% 10V C404 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C405 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C406 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C407 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C409 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C412 1-128-628-91 CERAMIC CHIP 0.0022uF 10% 6.3V C413 1-128-628-91 CERAMIC CHIP 0.0022uF 10% 6.3V C420 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V C421 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V C422 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V C423 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V C424 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V C425 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V C461 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C462 1-128-628-91 CERAMIC CHIP 0.0022uF 10% 6.3V C463 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C464 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C465 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C466 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C467 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C468 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C469 1-128-628-91 CERAMIC CHIP 0.0022uF 10% 6.3V C470 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C471 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C702 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C703 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C704 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C719 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C722 1-114-098-91 CERAMIC CHIP 2.2uF 20% 25V C723 1-100-670-91 CERAMIC CHIP 4.7uF 20% 16V C724 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C725 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V C727 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V C728 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C729 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V C730 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V C731 1-112-021-91 CERAMIC CHIP 2.2uF 20% 16V C732 1-112-021-91 CERAMIC CHIP 2.2uF 20% 16V C734 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V C735 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C736 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C737 1-114-098-91 CERAMIC CHIP 2.2uF 20% 25V * C2001 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C2002 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2005 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2007 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C2008 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2010 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V C2012 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C2013 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2014 1-128-605-11 CERAMIC CHIP 12PF 5% 25V C2015 1-128-606-91 CERAMIC CHIP 15PF 5% 25V C2016 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C2018 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2019 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2020 1-114-342-91 CERAMIC CHIP 0.033uF 10% 6.3V C2021 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2022 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2101 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2102 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V C2103 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V C2104 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V C2106 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2107 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V * C2108 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C2110 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2111 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2112 1-100-581-81 CERAMIC CHIP 0.0047uF 10% 50V C2113 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2114 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2115 1-164-942-11 CERAMIC CHIP 0.068uF 10% 16V C2116 1-164-942-11 CERAMIC CHIP 0.068uF 10% 16V C2117 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V * C2118 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C2119 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2120 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2122 1-164-933-11 CERAMIC CHIP 220PF 10% 50V C2123 1-164-874-11 CERAMIC CHIP 100PF 5% 50V C2124 1-164-933-11 CERAMIC CHIP 220PF 10% 50V C2125 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V C2201 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2203 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2205 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2207 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V * C2208 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C2209 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C2210 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C2211 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C2214 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2215 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2216 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2217 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2218 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2219 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2301 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V * C2302 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C2303 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2305 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2306 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2307 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2308 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C2309 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V < CONNECTOR > CN301 1-821-500-11 CONNECTOR, FPC (ZIF) 45P * CN401 1-821-503-11 CONNECTOR, FPC (ZIF) 39P * CN701 1-842-269-11 CONNECTOR, FPC (ZIF) 23P CN702 1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF)) 6P CN703 1-822-837-31 CARD CONNECTOR CN705 1-821-500-11 CONNECTOR, FPC (ZIF) 45P CN706 1-820-333-21 MULTI CONNECTOR (REC) 8P < DIODE > D001 6-502-934-01 DIODE DB2S31100K8 D002 6-503-318-01 DIODE DB2J20100L D003 6-503-318-01 DIODE DB2J20100L D004 6-503-318-01 DIODE DB2J20100L D301 6-501-106-01 DIODE 1SS387CT (TL3SONY) D701 8-719-056-23 DIODE MA2S111-(K8).SO D702 6-501-638-01 DIODE CL-271HR-C-TSL D2002 6-503-126-01 DIODE DA2S10100K8 * D2003 6-502-988-01 DIODE RB480Y-40T2R < FUSE > * F001 1-576-843-31 FUSE (0.8A/32V) * F002 1-576-843-31 FUSE (0.8A/32V) F003 1-576-415-31 FUSE (2A/32V) < FERRITE BEAD > FB301 1-400-331-11 FERRITE, EMI (SMD) (1005) FB302 1-400-331-11 FERRITE, EMI (SMD) (1005) < IC > IC001 6-716-846-01 IC MB44C022PW-G-ERE1 IC102 6-718-290-01 IC IDT6P40195NBG8 IC301 8-753-335-29 IC CXD5143GG-T2 IC302 6-718-360-01 IC RP102Z311D-TR-F IC303 6-718-359-01 IC RP102Z171D-TR-F IC304 6-703-977-01 IC R1114Q331D-TR-FA IC401 6-715-211-01 IC MM3404A28URE IC402 6-716-760-01 IC R2J30503LG IC2001 6-718-350-01 IC MB91696AEBGL-G-K2ERE1 IC2002 6-718-376-01 IC PST8422RL IC2301 (Not supplied) IC H9YA1GA1GHMYAR-2YMR-C < COIL > L001 1-481-036-11 INDUCTOR 4.7uH L002 1-460-359-11 INDUCTOR 4.7uH L004 1-481-036-11 INDUCTOR 4.7uH L005 1-481-036-11 INDUCTOR 4.7uH L006 1-460-359-11 INDUCTOR 4.7uH L007 1-481-036-11 INDUCTOR 4.7uH * L008 1-457-690-11 INDUCTOR 33uH L301 1-400-678-11 INDUCTOR 100uH L302 1-400-678-11 INDUCTOR 100uH * L702 1-481-642-11 INDUCTOR 10uH * L2102 1-481-102-21 INDUCTOR 10uH * L2103 1-481-102-21 INDUCTOR 10uH L2104 1-469-844-11 INDUCTOR 2.2uH < TRANSISTOR > * Q001 6-552-700-01 TRANSISTOR SSM3K15AMFV, L3SF Q302 8-729-053-57 TRANSISTOR RN1902FE Q304 8-729-053-57 TRANSISTOR RN1902FE * Q401 6-552-527-01 TRANSISTOR DMA964060R Q2002 6-552-716-01 TRANSISTOR FG6943010R * Q2003 6-552-397-01 TRANSISTOR DSC300100L Q2101 8-729-055-01 TRANSISTOR RN4984FE * Q2202 6-552-348-01 TRANSISTOR DRC3114E0L < RESISTOR > R001 1-240-810-11 METAL CHIP 12K 0.5% 1/20W R002 1-240-683-91 METAL CHIP 100 5% 1/20W R003 1-250-449-11 METAL CHIP 12 1% 1/16W R113 1-240-679-91 METAL CHIP 47 5% 1/20W Ref. No. Part No. Description Ref. No. Part No. Description SY-309

DSC-W630_L3 2-3E Ref. No. Part No. Description Ref. No. Part No. Description R301 (Not supplied) METAL CHIP 8.2K 1% 1/16W R302 1-240-729-91 METAL CHIP 1M 5% 1/20W R303 1-218-984-11 METAL CHIP 390K 5% 1/16W R304 1-250-547-11 METAL CHIP 150K 1% 1/16W * R307 1-250-527-11 METAL CHIP 22K 1% 1/16W R308 1-240-718-91 METAL CHIP 100K 5% 1/20W R401 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R402 (Not supplied) METAL CHIP 1.1K 0.5% 1/20W R403 1-240-695-91 METAL CHIP 1K 5% 1/20W R404 1-240-695-91 METAL CHIP 1K 5% 1/20W * R406 1-248-350-11 RES-CHIP 1.5 1% 1/3W R409 1-208-711-11 METAL CHIP 15K 0.5% 1/16W R420 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R421 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R422 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R423 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R424 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R425 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R440 1-240-707-91 METAL CHIP 10K 5% 1/20W R441 1-240-714-91 METAL CHIP 47K 5% 1/20W R442 1-240-703-91 METAL CHIP 4.7K 5% 1/20W R443 1-240-703-91 METAL CHIP 4.7K 5% 1/20W R445 1-240-689-91 METAL CHIP 330 5% 1/20W R446 1-240-684-91 METAL CHIP 120 5% 1/20W R447 1-240-684-91 METAL CHIP 120 5% 1/20W R459 1-240-707-91 METAL CHIP 10K 5% 1/20W R460 1-240-707-91 METAL CHIP 10K 5% 1/20W R701 1-240-687-91 METAL CHIP 220 5% 1/20W R704 1-240-703-91 METAL CHIP 4.7K 5% 1/20W R708 1-218-953-11 METAL CHIP 1K 5% 1/16W R709 1-218-953-11 METAL CHIP 1K 5% 1/16W R716 1-240-685-91 METAL CHIP 150 5% 1/20W R717 1-240-685-91 METAL CHIP 150 5% 1/20W R718 1-240-685-91 METAL CHIP 150 5% 1/20W R719 1-240-685-91 METAL CHIP 150 5% 1/20W R720 1-240-685-91 METAL CHIP 150 5% 1/20W R721 1-240-685-91 METAL CHIP 150 5% 1/20W R722 1-240-685-91 METAL CHIP 150 5% 1/20W R723 1-240-685-91 METAL CHIP 150 5% 1/20W R2001 1-250-521-11 METAL CHIP 12K 1% 1/16W R2008 1-240-718-91 METAL CHIP 100K 5% 1/20W R2014 1-240-714-91 METAL CHIP 47K 5% 1/20W R2017 1-240-830-11 METAL CHIP 100K 0.5% 1/20W R2019 1-240-830-11 METAL CHIP 100K 0.5% 1/20W R2021 1-240-726-91 METAL CHIP 470K 5% 1/20W R2024 1-240-714-91 METAL CHIP 47K 5% 1/20W R2026 1-240-714-91 METAL CHIP 47K 5% 1/20W R2027 1-240-695-91 METAL CHIP 1K 5% 1/20W R2028 1-240-714-91 METAL CHIP 47K 5% 1/20W R2029 1-240-707-91 METAL CHIP 10K 5% 1/20W R2030 1-240-714-91 METAL CHIP 47K 5% 1/20W R2042 1-240-707-91 METAL CHIP 10K 5% 1/20W R2044 1-240-714-91 METAL CHIP 47K 5% 1/20W R2045 1-240-683-91 METAL CHIP 100 5% 1/20W R2101 1-240-718-91 METAL CHIP 100K 5% 1/20W R2103 1-240-718-91 METAL CHIP 100K 5% 1/20W R2104 1-240-714-91 METAL CHIP 47K 5% 1/20W R2106 1-240-718-91 METAL CHIP 100K 5% 1/20W R2107 1-240-718-91 METAL CHIP 100K 5% 1/20W R2108 1-240-718-91 METAL CHIP 100K 5% 1/20W R2111 1-240-784-91 METAL CHIP 1K 0.5% 1/20W R2112 1-240-698-91 METAL CHIP 1.8K 5% 1/20W R2113 1-240-789-91 METAL CHIP 1.6K 0.5% 1/20W R2114 1-240-830-11 METAL CHIP 100K 0.5% 1/20W R2115 1-218-957-11 METAL CHIP 2.2K 5% 1/16W R2117 1-240-815-91 METAL CHIP 20K 0.5% 1/20W * R2118 1-240-819-91 METAL CHIP 30K 0.5% 1/20W * R2119 1-240-819-91 METAL CHIP 30K 0.5% 1/20W R2120 1-240-830-11 METAL CHIP 100K 0.5% 1/20W R2123 1-240-714-91 METAL CHIP 47K 5% 1/20W R2124 1-240-714-91 METAL CHIP 47K 5% 1/20W R2126 1-240-714-91 METAL CHIP 47K 5% 1/20W R2129 1-240-695-91 METAL CHIP 1K 5% 1/20W R2143 1-240-757-91 METAL CHIP 75 0.5% 1/20W R2144 1-240-718-91 METAL CHIP 100K 5% 1/20W R2145 1-240-718-91 METAL CHIP 100K 5% 1/20W R2151 1-240-685-91 METAL CHIP 150 5% 1/20W R2152 1-240-685-91 METAL CHIP 150 5% 1/20W R2153 1-240-685-91 METAL CHIP 150 5% 1/20W R2154 1-240-685-91 METAL CHIP 150 5% 1/20W R2155 1-240-685-91 METAL CHIP 150 5% 1/20W R2156 1-240-685-91 METAL CHIP 150 5% 1/20W R2157 1-240-685-91 METAL CHIP 150 5% 1/20W R2158 1-240-685-91 METAL CHIP 150 5% 1/20W R2159 1-240-697-91 METAL CHIP 1.5K 5% 1/20W R2201 1-240-707-91 METAL CHIP 10K 5% 1/20W R2203 1-240-701-91 METAL CHIP 3.3K 5% 1/20W R2204 1-240-685-91 METAL CHIP 150 5% 1/20W R2214 1-240-685-91 METAL CHIP 150 5% 1/20W R2221 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R2222 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R2223 1-240-767-91 METAL CHIP 200 0.5% 1/20W R2235 1-240-683-91 METAL CHIP 100 5% 1/20W R2236 1-240-683-91 METAL CHIP 100 5% 1/20W R2301 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R2302 1-240-808-11 METAL CHIP 10K 0.5% 1/20W < GYRO SENSOR > SE403 8-826-002-51 GYRO SENSOR GSU-X370D/N-S (PITCH/YAW) < THERMISTOR > TH2101 1-805-194-21 THERMISTOR, NTC (SMD) < VIBRATOR > * X101 1-487-897-11 SILICON OSCILLATOR (38MHz) X2002 1-781-525-11 VIBRATOR, CRYSTAL (32.768kHz) SY-309

4-1 DSC-W630_L3 4. BLOCK DIAGRAMS 4-1. OVERALL BLOCK DIAGRAM ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located. MEMORY STICK PRO DUO SD CD-837 FLEXIBLE BOARD POWER_SAVE CCD_OUT HIGH SPEED BUFFER AMP IC001 IC002 POWER_SAVE CCD_OUT VST CCD IMAGER VHLD VST VHLD H1, H2 H1, H2 V1A, V1B, V1C, V2, V3A, V3B, V3C, V4, V5A, V5B, V5C, V6, V7A, V7B, V7C, V8S1, V8S2 V1A, V1B, V1C, V2, V3A, V3B, V3C, V4, V5A, V5B, V5C, V6, V7A, V7B, V7C, V8S1, V8S2 LV1, LV2, VOG1, VOG2 LV1, LV2, VOG1, VOG2 LH1, RG LH1, RG SUB SUB SUB_CONT CA_AD00 - AD13 (7/9) IC301 CCD SIGNAL PROCESS, TIMING GENERATOR CA_VD CA_HD GEN_TG_CLK (2/9) CLOCK GENERATOR IC102 XSYS_RESET GEN_CLK_48MHz GEAR_ON X101 38MHz XSTRB_FULL STRB_CHG CN001 STRB_CHG_CONT STRB_ON XAF_LED RL-125 BOARD ST_UNREG Q001 FLASH DRIVE FLASH CONTROL, CHARGE CONTROL IC001 XE_A TRIGGER XE_K C901 CHARGING CAPACITOR ( ) D003 T001 (FLASH UNIT) (1/2) D101, D102 XPWR_LED S101, S102 XSHUT_SW XAE_LOCK_SW XPWR_ON CN701 + CN002 STRB_330V MA-472 FLEXIBLE BOARD STRB_ON1 XAF_LED XPOWER_LED XSHUT_SW XAE_LOCK_SW XPWR_ON XSTRB_FULL STRB_CHG STB_CHG_CNT FPC-025 FLEXIBLE BOARD MIC001 (MICROPHONE) MIC_SIG MIC_PI XAF_LED XRESET_REQ XSYS_RESET XCS_DD XWAKE Q2003 DC/DC CONVERTER (1/9) IC001 MSX_D0-D3, MSX_CLK/BS CN703 SD_WP XSD_IN XMS_IN SD_D0-D3, SD_CLK/CMD BL_L BL_H LCD BACKLIGHT 3.0 INCH COLOR LCD HALL ELEMENT PITCH_HALL ±, PITCH_BIAS - KEY_AD0 KEY_AD1 XDIRECT_PB KEY_AD0 KEY_AD1 XDIRECT_PB MODE_DIAL1 MODE_DIAL1 M HALL ELEMENT M PITCH MOTOR YAW MOTOR YAW ± YAW_HALL ±, YAW_BIAS - PITCH ± OPTICAL IMAGE STABILIZER LENS TEMP SENSOR LENS_TEMP M FOCUS RESET SENSOR FOCUS_A/XA/B/XB FC_SENS ZOOM RESET SENSOR M ZM_DC_FG_A/B ZOOM ± FOCUS MOTOR ZOOM MOTOR M MSHUT ± SHUTTER MOTOR ND ± IRIS_DIR_B, IRIS_BRK_B MSHUT_EN/DIR IC_402_3_SI/SO/SCK IC_402_3_EXPOSE IC_402_3_P_LIMIT CLK_IC_402_3 XCS_IC_402_3 IC_402_3_INT_REQ SE403 PITCH/YAW SENSOR (8/9) YAW_AD PITCH_AD D702 (MS ACCESS) TH2101 XACCESS_LED XIC_402_3_RST FPC-029 FLEXIBLE BOARD SW-583 BOARD M IRIS MOTOR : VIDEO SIGNAL : VIDEO/AUDIO SIGNAL : AUDIO SIGNAL V_OUT IRIS (METER) LENS SY-309 BOARD (3/9, 4/9, 5/9) XSYS_RESET LCD_XVD LCD_B_D0-D7 XCS_CLD PANEL_CHK CN705 LCD901 (LCD MODULE) OIS DRIVE, IRIS MOTOR DRIVE, SHUTTER MOTOR DRIVE, FOCUS MOTOR DRIVE, ZOOM MOTOR DRIVE (8/9) CPU, CAMERA DSP, AV SIGNAL PROCESS, LENS CONTROL, MODE CONTROL LENS BLOCK XSYS_RESET CA_VD 08 CN706 V_LINE_OUT AU_LINE_OUT_L SP ± MULTI CONNECTOR ( ) BL_H, BL_L D701 XAV_JACK_IN LCD_XHD LCD_CLK IC402 IC2001 CN301 USB_DP/DM GSIU3_SI/SO/SCK GSIU3_SO/SCK GSIU3_SI/SO/SCK GSIUO_SO/SCK XCS_FE INTERNAL MEMORY (6/9) IC2301 DDR_DATA00-DATA15 DDR_ADRS00-ADRS15 DDR_BA0-BA2 DDR_UDM/UDQS/XUDQS DDR_LDM/LDQS/ZLDQS DDR_XCAS/XRAS/XCS/XWE/ DDR_CLK/XCLK/CLKEN DDR_ODT NAND_IO0-IO7 NAND_ALE/CLE NAND_XCE/XRE/XWP/XWE NAND_RYXBY USB_VBUS Q2101 D_3.2V USB_DET X2002 32.768kHz SUBCK SUB CONTROL Q302, Q304 SUB_CONT RANDOM_TRIG VSUB_CONT_PRE, VSUB_CONT_POST, VSUB_CONT_MOV SP901 (SPEAKER) A5 2 7 33 34 H1 J2 30 29 42,44 8-24 27,28, 26,25 40, 38 6 35 C3 C4 C22 A21 1 3 8 AA25 D3 AC25 P1 N5 7 - 10 9 12 14 10 15 7 8 6 4 15 12 10 14 9 17 16 18 20 1 23 3 2 4 5,7 21,23, 1,3, 15,6 14 24 26 10,8, 11,16, 17,7 3 2 30 - 37 41,42 38 44 39 40 43 28 14, 16, 17 18 - 20 11 - 13 7 - 9 28 30 - 33 21 35, 38 23 - 26 5 - 2 6 , 1 CN401 D1 E4 E5 F5 R23 2 3 5 5 4 2 3 4 CN702 CN001 S001 - S009, S011 S010 B22 8 USB DETECT AA1 Y1

DSC-W630_L3 4-2E 4-2. POWER BLOCK DIAGRAM ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located. MEMORY STICK PRO DUO SD D102 POWER DC/DC CONVERTER (1/9) IC001 SY-309 BOARD F003 D003 ST_UNREG AUX_PWR_OFF SD_PWR_OFF F002 F001 D_3.2V MS_VCC TE_VCC MS_PWR_ON MS_PWR_ON CN703 L001 LX3 IN3 L006 D_1.8V L002 L007 L301 L702 L302 D_1.2V BL_H BL_L MS_PSW MS_VCC LX1 IN1 VO4 IN4 VL8 PSWOUT7 LX7 IN7 LX6 DISCHG Q001 -6.5V DISCHARGE INTERNAL MEMORY (6/9) IC2301 CLOCK GENERATOR IC102 M_5.0V D_3.2V IC2001 2.8V REG IC401 CE VDD VOUT 3 4 1 IC_402_2.8V D_1.8V D_1.2V PB7/MSPON/SD1DAT3 SD_PWR_OFF MS_PWR_ON A_3.2V D_3.2V D_3.2V IC402 CPU, CAMERA DSP, AV SIGNAL PROCESS, LENS CONTROL, MODE CONTROL (3/9, 4/9, 5/9) D_1.2V D_3.2V D_1.8V PITCH/YAW SENSOR SE403 OIS DRIVE, IRIS MOTOR DRIVE, SHUTTER MOTOR DRIVE, FOCU SMOTOR DRIVE, ZOOM MOTOR DRIVE (8/9) D_3.2V M_5.0V CAM_13V CAM_-6.5V D004 D002 M_5.0V A_3.2V D_1.8V_GEN BATT_SIG REG_GND S + BATT_UNREG - BH701 (BATTERY TERMINAL) PSWOUT5 VO5 IN5 CN705 CD-837 FLEXIBLE BOARD CCD IMAGER IC002 CAM_-6.5V CAM_13V HIGH SPEED BUFFER AMP BL_H BL_L VDD VL VH LCD BACKLIGHT LCD901 (LCD MODULE) IC001 CN401 LENS BLOCK IC_402_2.8V BATT_SENS 08 CN301 3.1V REG IC302 VOUT CE CCD SIGNAL PROCESS, TIMING GENERATOR IC301 D_3.2V VDD D_3.2V_CH D_3.2V PC2/SD0LEDX (2/9) PRBTM OVP8 (7/9) REG_UNREG L005 IN6 L008 IC_402_2.8V (8/9) LX8 CN001 ST_UNREG RL-125 BOARD D003 T001 FLASH CONTROL, CHARGE CONTROL IC001 D_3.2V + C901 CHARGING CAPACITOR ( ) ST_UNREG CN701 (FLASH UNIT) FPC-025 FLEXIBLE BOARD BT900 LITHIUM BATTERY CN002 MA-472 FLEXIBLE BOARD SELF-TIMER, SMILE TIMER, AF ILLUMINATOR VL_3V STRB_330V (1/2) D101 M_5.0V D_3.2V VL_3V VL_3V M_5.0V (8/9) (7/9) D_3.2V_CH A_3.2V VO_5.0V D_1.8V_GEN D_1.8_CH 3.3V REG IC304 VOUT CE VDD (7/9) 1.7V REG IC303 Vout CE VDD (7/9) Q2002 D2002 Q401 BATT_SENS XSYS_RESET XSYS_RESET PWM8 LCD_CABC_PWM TE_VCC AUX_PSW P73/FPINT03/WPPG11 LCD_CABC_PWM Q2202 RESET (3/9) IC2002 OUT VDD ADVIN5 VOUT2 EVER D001 PRBTY PRBLVD RTCBTY VL_3V PRRSTX CAM_13V CAM_-6.5V D_1.8_CH XZM_FG_LED XFC_RST_LED P34/AU1CLK P35/AU1LR D_3.2V L2103 AU_3.2V L2102 AD_3.2V A_3.2V VI_3.2V BACKUP VL_3V DVDD_H DVDD_LHRG AVDD_AFDL CN703 2.7 INCH COLOR LCD B5 B6 G8 F7 F2 H6 H7 G6 34 32 25, 27 10,15 3 2 A5 B4 A8 A2 B3 F4 G5 B7 C7 G2 F1 G1 A4 D2 AA3 1 2 4 H4 19 12 19 11 1 - 3 5 13 21 - 23 11 7 - 10 13 4 1 3 1 2 4 E5 E6 A7 AC24 4 2 AC5 C3 AA5 AB1 Y2 AB3 F_PI_A 27 Z_FG1_A 34 XZM_FG_LED XFC_RST_LED G6 F5 BATT SENS SWITCH LED DRIVE

DSC-W630_L3 5-1E 5. FRAME SCHEMATIC DIAGRAMS 1 23 23 1 1 10 1 6 6 1 1 45 S101 (SHUTTER) S102 MIC001 ON/OFF ( ) MICROPHONE UNIT RED (MULTI CONNECTOR) S001 S002 S003 S004 (UP) S005 (LEFT) S006 (DOWN) S007 (SET) S008 (RIGHT) S009 S011 (DELETE) MENU 1 8 9 10 11 12 1 26 27 28 CN703 CN706 1 2 22 23 1 7 6 8 1 2 44 CN705 45 1 2 38 39 1 2 44 45 CN401 SE403 (PITCH/YAW) CN301 CN701 CN702 2 CN001 22 1 23 1 10 12 11 CN002 1 7 6 8 CN001 IC002 (Not supplied) IC2301 (Not supplied) ( ) C901 (FLASH UNIT) S010 (MODE) STILL IMAGE SWEEP PANORAMA MOVIE RL-125 BOARD (SIDE A) RL-125 BOARD (SIDE B) MA-472 FLEXIBLE BOARD SP901 (SPEAKER) SY-309 BOARD (SIDE B) FPC-025 FLEXIBLE BOARD CD-837 FLEXIBLE BOARD FPC-029 FLEXIBLE BOARD SY-309 BOARD (SIDE A) SW-583 BOARD (SIDE B) W T (ZOOM) SW-583 BOARD (SIDE A) CHARGING CAPACITOR BT900 (LITHIUM BATTERY) LENS BLOCK BH701 (BATTERY TERMINAL) s LCD901 (LCD MODULE) 2.7 INCH COLOR LCD LCD BACKLIGHT

6-1 DSC-W630_L3 6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS – ENGLISH – – JAPANESE – THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS. (In addition to this, the necessary note is printed in each block.) For Schematic Diagrams • All capacitors are in μF unless otherwise noted. pF : μ μF. 50 V or less are not indicated except for electrolytics and tantal- ums. • Chip resistors are 1/10 W unless otherwise noted. kΩ=1000 Ω, MΩ=1000 kΩ. • Caution when replacing chip parts. New parts must be attached after removal of chip. Be careful not to heat the minus side of tantalum capacitor, Because it is damaged by the heat. • Some chip part will be indicated as follows. Example C541 L452 22U 10UH TA A 2520 Kinds of capacitor External dimensions (mm) Case size • Constants of resistors, capacitors, ICs and etc with XX indicate that they are not used. In such cases, the unused circuits may be indicated. • Parts with ★ differ according to the model/destination. Refer to the mount table for each function. • All variable and adjustable resistors have characteristic curve B, unless otherwise noted. • Signal name XEDIT → EDIT PB/XREC → PB/REC • : non flammable resistor • : fusible resistor • : panel designation • : B+ Line • : B– Line • : IN/OUT direction of (+, –) B LINE. • : adjustment for repair. For Printed Wiring Boards • : Uses unleaded solder. • : Circuit board : Flexible board Pattern from the side which enables seeing. : pattern of the rear side (The other layers’ patterns are not indicated) • Through hole is omitted. • There are a few cases that the part printed on diagram isn’t mounted in this model. • : panel designation • Chip parts. Transistor Diode 2 1 3 2 1 3 2 1 3 3 4 5 2 1 1 2 3 6 5 4 E B C 3 1 5 2 4 6 1 2 3 6 5 4 3 1 5 2 4 6 1 2 3 5 4 4 3 1 2 3 12 4 5 5 34 1 2 1 4 2 3 4 6 2 5 3 1 1 2 4 3 1 4 2 3 Precautions for Replacement of Imager • If the imager has been replaced, carry out all the adjustments for the camera section. • As the imager may be damaged by static electricity from its structure, handle it carefully like for the MOS IC. In addition, ensure that the receiver is not covered with dusts nor exposed to strong light. When indicating parts by reference number, please include the board name. The components identified by mark or dotted line with mark are critical for safety. Replace only with part number specified. Les composants identifiés par une marque sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. 回路図，プリント図共通ノート（他に必要なノートは各セクションに記載しています）回路図ノート・ケミコン，タンタルを除くコンデンサで，耐圧50V以下のものはその耐圧を省略。単位はすべてμF（pはpF）。・チップ抵抗で指示のないものは，1/10W以下。 kΩ＝1000Ω，MΩ＝1000kΩ ・チップ部品交換時の注意取り外した部品は再使用せず，未使用の部品をご使用ください。タンタルコンデンサのマイナス側は熱に弱いため注意してください。・チップ部品には下記のように表示したものがあります。例 C541 L452 22U 10UH TA A 2520 種類　　　　　　外形寸法（mm）ケースサイズ・抵抗，コンデンサ，ICなど定数にXXがあるものは，使用していない事を示しています。このため，使用していない回路が記載されている事があります。・ ★印のある部品は，機種などにより異なりますので機能別マウント一覧表を参照してください。・可変抵抗と半固定抵抗で，B特性の表示を省略。・信号名表記について，下記のような場合があります。 XEDIT　→　EDIT　　　　PB/XREC　→　PB/REC ・は不燃性抵抗。・はヒューズ抵抗。・はパネル表示名称。・はB＋ライン。・はB－ライン。・はBライン（＋，－）の入出力方向を示す。・は調整名称。プリント図ノート・：無鉛半田を使用しています。・：基板：フレキシブル配線板見ている面側のパターン。：裏側のパターン（他のパターンについては表示されていません）・スルーホールは省略。・プリント図には，本機で使用していない部品が記載されている場合があります。・はパネル表示名称。 • Chip parts. Transistor　　　　　　　　　　Diode 2 1 3 2 1 3 2 1 3 3 4 5 2 1 1 2 3 6 5 4 E B C 3 1 5 2 4 6 1 2 3 6 5 4 3 1 5 2 4 6 1 2 3 5 4 4 3 1 2 3 12 4 5 5 34 1 2 1 4 2 3 4 6 2 5 3 1 1 2 4 3 1 4 2 3 イメージャ交換時の注意・イメージャを交換した場合は，カメラ部の全調整を行ってください。・イメージャは構造上，静電気により破壊される恐れがあるため，MOS ICと同様に注意して取り扱ってください。また，受光部にはゴミの付着，および強い光がはいることのないように注意してください。図面番号で部品を指定するときは基板名又はブロックを併せて指定してください。お願い印の部品，または印付の点線で囲まれた部品は，安全性を維持するために，重要な部品です。従って交換時は，必ず指定の部品を使用してください。

6-2 DSC-W630_L3 6-1. SCHEMATIC DIAGRAMS SY-309 (7/9) CN301 (PAGE 6-9) Note: IC002 is not supplied, but this is included in CD-837 FLEXIBLE COMPLETE BOARD. 1 2 3 4 5 6 7 8 9 A B C D E F A B C D E F 08 CD-837 FLEXIBLE BOARD CCD IMAGER VOG1 V7B V3A V7A V2 LV2 V1B V5C VHLD V6 V1C VST V8S2 V4 LV1 VOG2 V5A V3B V7C V3C V8S1 V5B V1A RG V1A V1B V1C V2 V3A V3B V3C V4 V5A V5B V5C V6 V7A V7B V7C V8S1 V8S2 VOG2 VOG1 LV1 LV2 VHLD VST CAM_-6.5V LH1 H1 H2 CAM_13V SUB C003 0.1u C007 0.1u C005 0.1u C006 0.1u R003 270k IC001 CXA3841UR-T9 1 IDRV_L 2 IDRV_H 3 Vcc 4 ISF_H 5 ISFSW 6 ISF_L 7 ISF_P 8 BUFIN 9 ISF_N 10 GND 11 OUT 12 ICONT R004 220k C001 0.1u R002 180k C002 0.1u R001 220k C008 0.0022u 50V C004 0.1u IC002 ICX682SQL-13 5 V1C 6 V2 7 V3A 8 V3B 9 V3C 10 V4 13 V5C 14 V6 15 V7A 16 V7B 17 V7C 18 V8S1 24 AGND 25 AGND 26 LH1 22 VL 23 RG 30 H1 1 SUB 2 VGND 3 V1A 11 V5A 27 NC 19 V8S2 4 V1B 12 V5B 20 VOUT 21 VDD 28 CSUB 29 SUB_CONT 31 H2 32 NC 33 VST 34 VHLD 35 LV2 36 LV1 37 VOG1 38 VOG2 45P 1 REG_GND 2 CCD_OUT 3 REG_GND 4 REG_GND 5 REG_GND 6 SUB 7 POWER_SAVE 8 V1A 9 V1B 10 V1C 11 V2 12 V3A 13 V3B 14 V3C 15 V4 16 V5A 17 V5B 18 V5C 19 V6 20 V7A 21 V7B 22 V7C 23 V8S1 24 V8S2 25 VOG2 26 VOG1 27 VL1 28 VL2 29 VHLD 30 VST 31 REG_GND 32 VH 33 REG_GND 34 VL 35 SUB_CONT 36 REG_GND 37 REG_GND 38 RG 39 REG_GND 40 LH1 41 REG_GND 42 H1 43 REG_GND 44 H2 45 REG_GND LND002 LND003 LND001 30pin 42pin 31pin 41pin 5pin 24pin 38pin 35pin 25pin 39pin 18pin 13pin 27pin 16pin 29pin 44pin 17pin 21pin 26pin 12pin 19pin 1pin 43pin 23pin 36pin 40pin 3pin 10pin 34pin 7pin 4pin 9pin 15pin 6pin 8pin 11pin 45pin 33pin 2pin 22pin 37pin 28pin 14pin 20pin 32pin LND004 LND006 LND005 LND010 LND012 LND011 LND007 LND009 LND008 LND016 LND018 LND019 LND022 LND017 LND020 LND013 LND015 LND024 LND014 LND021 LND023 LND028 LND030 LND031 LND039 LND041 LND038 LND034 LND029 LND032 LND045 LND025 LND037 LND027 LND036 LND043 LND026 LND044 LND033 LND042 LND035 LND040 BUFFER AMP HIGH SPEED CCD IMAGER

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Sony Cyber Shot DSC-W630 Service Manual & Repair Guide

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