Sony Cyber Shot DSC-TX20 Service Manual & Repair Guide

SERVICE MANUAL DSC-TX20_L3 LEVEL 3 Check the SERVICE NOTE (LEVEL 2) before the service. Revision History Published by Sony Techno Create Corporation Sony Corporation 983465711.pdf Ver. 1.0 2012.03 DIGITAL STILL CAMERA The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. DSC-TX20 9-834-657-11 US Model Canadian Model AEP Model UK Model E Model Australian Model Hong Kong Model Chinese Model Korea Model Japanese Model Photo: Black Ver. Date History Contents S.M. Rev. issued 1.0 2012.03 Official Release — — 2012C08-1 © 2012.03

– 2 – DSC-TX20_L3 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO- NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM- PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. Caution Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type. Dispose of used batteries according to the instructions. 注意電池の交換は，正しく行わないと破裂する恐れがあります。電池を交換する場合には必ず同じ型名の電池又は同等品と交換してください。使用済み電池は，取扱指示に従って処分してください。 SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer. 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are “pinched” or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. 5. Check the B+ voltage to see it is at the values specified. 6. Flexible Circuit Board Repairing • Set the soldering iron tip temperature to 350 °C approximately. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. 1. 注意事項をお守りください。サービスのとき特に注意を要する個所については，キャビネット，シャーシ，部品などにラベルや捺印で注意事項を表示しています。これらの注意書き及び取扱説明書等の注意事項を必ずお守り下さい。 2. 指定部品のご使用をセットの部品は難燃性や耐電圧など安全上の特性を持ったものとなっています。従って交換部品は，使用されていたものと同じ特性の部品を使用して下さい。特に回路図，部品表に0印で指定されている安全上重要な部品は必ず指定のものをご使用下さい。 3. 部品の取付けや配線の引きまわしはもとどおりに安全上，チューブやテープなどの絶縁材料を使用したり，プリント基板から浮かして取付けた部品があります。また内部配線は引きまわしやクランパによって発熱部品や高圧部品に接近しないよう配慮されていますので，これらは必ずもとどおりにして下さい。 4. サービス後は安全点検をサービスのために取外したネジ，部品，配線がもとどおりになっているか，またサービスした個所の周辺を劣化させてしまったところがないかなどを点検し，安全性が確保されていることを確認して下さい。 5. チップ部品交換時の注意・取外した部品は再使用しないで下さい。・タンタルコンデンサのマイナス側は熱に弱いため交換時は注意して下さい。 6. フレキシブルプリント基板の取扱いについて・半田こてのこて先温度は約350℃に設定してください。・同一パターンに何度もコテ先を当てないで下さい。（3回以内）・パターンに力が加わらないよう注意して下さい。サービス，点検時には次のことにご注意ください。 – ENGLISH – – JAPANESE – UNLEADED SOLDER This unit uses unleaded solder. Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Be careful to the following points to solder or unsolder. • Set the soldering iron tip temperature to 350 °C approximately. If cannot control temperature, solder/unsolder at high temperature for a short time. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Be sure to control soldering iron tips used for unleaded solder and those for leaded solder so they are managed separately. Mixing unleaded solder and leaded solder will cause detachment phenomenon. 無鉛半田について本機には無鉛半田が使用されています。無鉛半田を使用している基板には，無鉛（Lead Free）を意味するレッドフリーマークがプリントされています。（注意：基板サイズによっては，無鉛半田を使用していてもレッドフリーマークがプリントされていないものがあります）：レッドフリーマーク無鉛半田は，下記の点に注意して使用してください。・半田こてのこて先温度は約350℃に設定してください。温度調節が無理な場合は，高温短時間で作業を行ってください。注意：半田こてを長く当てすぎると，基板のパターン（銅箔）がはがれてしまうことがありますので，注意してください。また，従来の半田よりも粘性が強いため， IC端子などが半田ブリッジしないように注意してください。・半田こてのこて先は，必ず無鉛半田用と有鉛半田用に分けて管理してください。無鉛半田と有鉛半田が混在すると剥離現象が発生してしまいます。

DSC-TX20_L3 2-1 Ref. No. Part No. Description Ref. No. Part No. Description 2. REPAIR PARTS LIST (ENGLISH) NOTE: • -XX, -X mean standardized parts, so they may have some differ- ences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Due to standardization, replacements in the parts list may be dif- ferent from the parts specified in the diagrams or the components used on the set. • CAPACITORS: uF: μF • COILS uH: μH • RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable • SEMICONDUCTORS In each case, u: μ, for example: uA...: μA... , uPA... , μPA... , uPB... , μPB... , uPC... , μPC... , uPD..., μPD... When indicating parts by reference number, please include the board name. The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. Caution Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type. Dispose of used batteries according to the instructions. Note 1: Be sure to read “Precautions for Replacement of Imager” on page 6-1. (JAPANESE) 【使用上の注意】 • ここに記載されている部品は, 補修用部品であるため, 回路図及びセットに付いている部品と異なる場合があります。 • -XX, -Xは標準化部品のため, セットに付いている部品と異なる場合があります。 • *印の部品は常備在庫しておりません。 • コンデンサの単位でuFはμFを示します。 • 抵抗の単位Ωは省略してあります。金　　被：金属被膜抵抗。サンキン：酸化金属被膜抵抗。 • インダクタの単位でuHはμHを示します。 • 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれμA..., μPA..., μPB..., μPC..., μPD...を示します。図面番号で部品を指定するときは基板名又はブロックを併せて指定してください。お願い 0印の部品，または0印付の点線で囲まれた部品は，安全性を維持するために，重要な部品です。従って交換時は，必ず指定の部品を使用してください。注意電池の交換は，正しく行わないと破裂する恐れがあります。電池を交換する場合には必ず同じ型名の電池又は同等品と交換してください。使用済み電池は，取扱指示に従って処分してください。 Note 1: イメージャの交換時は6-1ページの“イメージャ交換時の注意”を必ずお読みください。 1-882-890-11 BT-066 FLEXIBLE BOARD ******************** A-1871-437-A CD-843 FLEXIBLE BOARD, COMPLETE ****************************** (All mounted parts are not supplied, but they are included in CD-843 FLEXIBLE COMPLETE BOARD) A-1814-469-A HC-017 FLEXIBLE BOARD, COMPLETE ****************************** < CONNECTOR > CN001 1-842-602-11 CONNECTOR, HDMI A-1814-470-A RL-106 FLEXIBLE BOARD, COMPLETE ****************************** (BT001 is not included in RL-106 FLEXIBLE COMPLETE BOARD) (D002 is not supplied, but this is included in RL-106 FLEXIBLE COMPLETE BOARD) < BATTERY > BT001 1-756-710-12 LITHIUM RECHARGEABLE BATTERY < DIODE > D002 (Not supplied) DIODE SML-522MY8WT86 < RESISTOR > R001 1-218-957-11 METAL CHIP 2.2K 5% 1/16W R002 1-218-945-11 METAL CHIP 220 5% 1/16W < SWITCH > S001 1-786-914-31 SWITCH, TACTILE S002 1-786-914-31 SWITCH, TACTILE * S003 1-798-136-21 TACTILE SWITCH * S004 1-786-914-51 SWITCH, TACTILE * S005 1-786-914-51 SWITCH, TACTILE * S006 1-786-914-51 SWITCH, TACTILE A-1871-436-A ST-285 BOARD, COMPLETE ********************** < CAPACITOR > C001 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C002 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V * C006 1-116-456-11 CERAMIC CHIP 0.047uF 10% 350V C007 1-100-761-21 CERAMIC CHIP 0.01uF 10% 250V < CONNECTOR > CN004 1-819-973-61 CONNECTOR, FPC (LIF (NON-ZIF)) < DIODE > * D002 6-503-237-01 DIODE RKH0160AKU * D003 6-503-001-01 DIODE RR255M-400FJTR D008 6-503-448-01 DIODE SML-L14DTAFS < IC > IC001 6-716-806-01 IC R2J20071DNS < COIL > * L001 1-400-820-11 INDUCTOR 2.2uH < TRANSISTOR > Q003 6-552-987-01 TRANSISTOR RJP4010AGE-01 < RESISTOR > R003 1-208-861-81 METAL CHIP 82 0.5% 1/16W R004 1-216-121-11 METAL CHIP 1M 5% 1/10W R005 1-216-097-11 METAL CHIP 100K 5% 1/10W R007 1-208-643-11 METAL CHIP 22 0.5% 1/16W R008 1-208-889-11 METAL CHIP 1.2K 0.5% 1/16W R009 1-218-871-11 METAL CHIP 10K 0.5% 1/10W < TRANSFORMER > * T001 1-445-749-21 D.C.-D.C.CONVERTER TRANSFORMER A-1871-517-A SY-333 BOARD, COMPLETE (SERVICE) ******************************* (CN705, IC211, MIC101 and MIC102 are not supplied, but they are included in SY-333 COMPLETE BOARD (SERVICE).) < CAPACITOR > C001 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C002 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C003 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C004 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C005 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C006 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C007 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C008 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C009 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C010 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C011 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C012 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V C013 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C014 1-100-671-11 CERAMIC CHIP 4.7uF 20% 25V C022 1-165-908-11 CERAMIC CHIP 1uF 10% 10V C026 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C027 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C028 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C029 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C055 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C056 1-114-246-11 CERAMIC CHIP 1uF 20% 25V * C057 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V * C058 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V C059 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C065 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C102 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C103 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C104 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C105 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V C106 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V 2-2. ELECTRICAL PARTS LIST BT-066 CD-843 HC-017 RL-106 ST-285 SY-333

DSC-TX20_L3 2-2 Ref. No. Part No. Description Ref. No. Part No. Description C107 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C108 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C109 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C110 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C111 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C112 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C113 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V C114 1-164-852-11 CERAMIC CHIP 12PF 5% 50V C115 1-164-852-11 CERAMIC CHIP 12PF 5% 50V C116 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C214 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C217 1-116-403-91 CERAMIC CHIP 10uF 10% 6.3V C218 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C219 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C220 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C221 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C222 1-116-729-11 CERAMIC CHIP 2.2uF 20% 10V C223 1-116-729-11 CERAMIC CHIP 2.2uF 20% 10V C226 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C228 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C229 1-116-729-11 CERAMIC CHIP 2.2uF 20% 10V C233 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C235 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C236 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C237 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C238 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C239 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V C240 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C241 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C243 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C244 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C252 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C253 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C254 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C256 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C257 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C258 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C260 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C263 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C268 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C270 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C274 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C275 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C353 1-116-729-11 CERAMIC CHIP 2.2uF 20% 10V C355 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C357 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V C358 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V C359 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C360 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C361 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C362 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C365 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C366 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C367 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C368 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C369 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C370 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C371 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C372 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C373 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V C374 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V C375 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V C376 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C377 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C401 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C405 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C406 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C407 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C408 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C422 1-137-987-81 CERAMIC CHIP 0.068uF 10% 10V C423 1-137-987-81 CERAMIC CHIP 0.068uF 10% 10V C424 1-137-987-81 CERAMIC CHIP 0.068uF 10% 10V C425 1-137-987-81 CERAMIC CHIP 0.068uF 10% 10V C451 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C460 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C461 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C462 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C463 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V C464 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C465 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C466 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C467 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C468 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C469 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C470 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V C471 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V C701 1-112-692-11 CERAMIC CHIP 1000PF 5% 50V C703 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C704 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V C781 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V C782 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C783 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V C784 1-165-908-11 CERAMIC CHIP 1uF 10% 10V C785 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C786 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V C787 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C788 1-112-021-91 CERAMIC CHIP 2.2uF 20% 16V C790 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V C791 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C792 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V C793 1-165-908-11 CERAMIC CHIP 1uF 10% 10V C794 1-165-908-11 CERAMIC CHIP 1uF 10% 10V < CONNECTOR > * CN401 1-817-942-81 CONNECTOR, FPC (ZIF) 39P CN701 1-822-970-11 MULTI CONNECTOR (REC) CN702 1-817-828-81 CONNECTOR, FPC (ZIF) 25P CN704 1-822-837-31 CARD CONNECTOR CN705 (Not supplied) CONNECTOR, PC BOARD TO PC BOARD CN706 1-820-634-51 CONNECTOR, FPC (LIF (NON-ZIF)) 10P CN751 1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF)) 6P * CN753 1-822-038-81 CONNECTOR, FPC (ZIF) 61P * CN756 1-821-502-11 CONNECTOR, FPC (ZIF) 29P < DIODE > D001 6-502-934-01 DIODE DB2S31100K8 D002 6-503-318-01 DIODE DB2J20100L * D053 6-502-950-01 DIODE RB550VA-30TR D055 6-503-217-01 DIODE RKZ5.6B2KJR1 D056 6-502-934-01 DIODE DB2S31100K8 * D211 6-502-988-01 DIODE RB480Y-40T2R D251 8-719-056-23 DIODE MA2S111-(K8).SO * D702 6-502-766-01 DIODE SML-D12V8WT86RSN D705 6-502-934-01 DIODE DB2S31100K8 D706 6-502-934-01 DIODE DB2S31100K8 D752 8-719-056-23 DIODE MA2S111-(K8).SO D754 6-502-934-01 DIODE DB2S31100K8 < FUSE > * F001 1-576-843-31 FUSE (0.8A/32V) F050 1-576-415-31 FUSE (2A/32V) F052 1-576-415-31 FUSE (2A/32V) * F053 1-576-843-31 FUSE (0.8A/32V) < FERRITE BEAD > FB351 1-400-619-11 BEAD, FERRITE (CHIP) (1608) < IC > IC001 6-716-846-01 IC MB44C022PW-G-ERE1 IC003 6-716-873-01 IC RP109L111DA-TR IC004 6-717-900-01 IC RP173K501B-TR IC005 6-717-070-01 IC RP110L121D-TR IC006 6-717-072-01 IC RP110L181D-TR IC051 6-718-065-01 IC MAX8976EWA+T IC052 6-716-783-01 IC BD11600NUX-E2 IC056 6-717-898-01 IC BD6047GUL-E2 IC101 6-716-838-01 IC BU76381GUW-E2 IC211 (Not supplied) IC OLY2G2G07A IC213 6-716-878-01 IC AK8153AU-L IC401 6-716-760-01 IC R2J30503LG IC402 6-715-211-01 IC MM3404A28URE IC403 6-716-952-01 IC R2A30427BM < COIL > L001 1-481-036-11 INDUCTOR 4.7uH L002 1-457-696-11 INDUCTOR 4.7uH L003 1-481-036-11 INDUCTOR 4.7uH L004 1-481-036-11 INDUCTOR 4.7uH L005 1-457-696-11 INDUCTOR 4.7uH * L006 1-457-690-11 INDUCTOR 33uH * L702 1-481-642-11 INDUCTOR 10uH < LINE FILTER > LF702 1-457-539-11 COMMON MODE CHOKE COIL LF703 1-457-539-11 COMMON MODE CHOKE COIL < MICROPHONE > MIC101 (Not supplied) MICROPHONE MIC102 (Not supplied) MICROPHONE < TRANSISTOR > * Q001 6-552-490-01 TRANSISTOR SCH1433-S-TL-H * Q002 6-552-029-01 TRANSISTOR MCH3377-S-TL-E Q003 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF * Q052 6-552-530-01 TRANSISTOR DMC964030R Q055 6-552-975-01 TRANSISTOR RW1A030APT2CR Q058 6-551-631-01 TRANSISTOR RN1104MFV (TL3S Q211 6-551-202-01 TRANSISTOR LM6K1FS8T2R Q212 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF < RESISTOR > R011 1-220-876-81 METAL CHIP 18 0.5% 1/16W R042 1-240-718-91 METAL CHIP 100K 5% 1/20W R043 1-240-729-91 METAL CHIP 1M 5% 1/20W R044 1-240-731-91 METAL CHIP 1.5M 5% 1/20W R053 1-218-977-11 METAL CHIP 100K 5% 1/16W R054 1-208-927-11 METAL CHIP 47K 0.5% 1/16W R060 1-218-977-11 METAL CHIP 100K 5% 1/16W R061 1-240-718-91 METAL CHIP 100K 5% 1/20W R066 1-240-707-91 METAL CHIP 10K 5% 1/20W R071 1-218-953-11 METAL CHIP 1K 5% 1/16W R075 1-240-718-91 METAL CHIP 100K 5% 1/20W R077 1-240-703-91 METAL CHIP 4.7K 5% 1/20W R115 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W R116 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W R218 1-208-869-11 METAL CHIP 180 0.5% 1/16W R221 1-240-804-11 METAL CHIP 6.8K 0.5% 1/20W * R223 1-250-469-11 METAL CHIP 82 1% 1/16W R225 1-240-695-91 METAL CHIP 1K 5% 1/20W R226 1-218-965-11 METAL CHIP 10K 5% 1/16W R228 1-250-481-11 METAL CHIP 270 1% 1/16W R231 1-240-712-91 METAL CHIP 27K 5% 1/20W R233 1-218-935-11 METAL CHIP 33 5% 1/16W R234 1-240-698-91 METAL CHIP 1.8K 5% 1/20W R235 1-240-698-91 METAL CHIP 1.8K 5% 1/20W R269 1-240-695-91 METAL CHIP 1K 5% 1/20W R270 1-240-695-91 METAL CHIP 1K 5% 1/20W R302 1-208-935-11 METAL CHIP 100K 0.5% 1/16W R303 1-240-707-91 METAL CHIP 10K 5% 1/20W R309 1-240-714-91 METAL CHIP 47K 5% 1/20W R310 1-208-943-11 METAL CHIP 220K 0.5% 1/16W R311 1-208-943-11 METAL CHIP 220K 0.5% 1/16W R321 1-240-683-91 METAL CHIP 100 5% 1/20W R322 1-240-683-91 METAL CHIP 100 5% 1/20W R323 1-240-683-91 METAL CHIP 100 5% 1/20W R324 1-240-683-91 METAL CHIP 100 5% 1/20W R325 1-240-683-91 METAL CHIP 100 5% 1/20W R326 1-240-683-91 METAL CHIP 100 5% 1/20W R327 1-218-941-81 METAL CHIP 100 5% 1/16W R328 1-218-941-81 METAL CHIP 100 5% 1/16W R329 1-218-941-81 METAL CHIP 100 5% 1/16W R330 1-218-941-81 METAL CHIP 100 5% 1/16W R331 1-218-941-81 METAL CHIP 100 5% 1/16W R332 1-218-941-81 METAL CHIP 100 5% 1/16W R353 1-208-668-11 METAL CHIP 240 0.5% 1/16W R418 1-208-711-11 METAL CHIP 15K 0.5% 1/16W R423 1-208-911-11 METAL CHIP 10K 0.5% 1/16W R424 1-208-911-11 METAL CHIP 10K 0.5% 1/16W R425 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R426 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R427 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R428 1-240-808-11 METAL CHIP 10K 0.5% 1/20W R430 1-240-714-91 METAL CHIP 47K 5% 1/20W SY-333 Ref. No. Part No. Description Ref. No. Part No. Description

DSC-TX20_L3 2-3E Ref. No. Part No. Description R431 1-240-688-91 METAL CHIP 270 5% 1/20W R432 1-240-688-91 METAL CHIP 270 5% 1/20W R433 1-240-714-91 METAL CHIP 47K 5% 1/20W R456 1-240-707-91 METAL CHIP 10K 5% 1/20W R457 1-240-707-91 METAL CHIP 10K 5% 1/20W R458 1-240-711-91 METAL CHIP 22K 5% 1/20W R459 1-240-711-91 METAL CHIP 22K 5% 1/20W R716 1-240-695-91 METAL CHIP 1K 5% 1/20W R757 1-240-687-91 METAL CHIP 220 5% 1/20W R771 1-240-683-91 METAL CHIP 100 5% 1/20W R772 1-240-687-91 METAL CHIP 220 5% 1/20W R773 1-218-957-11 METAL CHIP 2.2K 5% 1/16W R1018 1-240-714-91 METAL CHIP 47K 5% 1/20W < COMPOSITION CIRCUIT BLOCK > RB251 1-234-377-21 RES, NETWORK 4.7K (1005X4) < SENSOR > * SE001 1-489-735-11 SENSOR, ANGULAR VELOCITY (PITCH/YAW) * SE101 1-489-167-11 SENSOR MAGNETIC < THERMISTOR > TH051 1-805-194-21 THERMISTOR, NTC (SMD) TH251 1-805-194-21 THERMISTOR, NTC (SMD) < VIBRATOR > X101 1-781-525-11 VIBRATOR, CRYSTAL (32.768kHz) * X211 1-487-897-21 SILICON OSCILLATOR (72MHz) SY-333

4-1 DSC-TX20_L3 4. BLOCK DIAGRAMS 4-1. OVERALL BLOCK DIAGRAM ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located. ( ) MULTI CONNECTOR XSYS_RESET XSYS_RESET CLOCK GENERATOR (4/8) IC213 38 28 - 31 32 - 35 24 - 27 5 - 2 16, 1 11,10,14 12,7,8 37 21 20 18 XSHUT_SW SY-333 BOARD LENS LENS BLOCK IRIS (METER) IRIS MOTOR M PITCH/YAW SENSOR (7/8) SE001 M PITCH MOTOR XAE_LOCK_SW XSHUT_SW XAE_LOCK_SW M M M IRIS_DIR_A/B, IRIS_BRK_A/B ZM_DIR_A/B, ZM_BRK_A XSYS_RESET BACKUP_VDD BACKUP_VDD XIC_401_RST FC_DIR_B, FC_BRK_A FC_DIR_A/B, FC_BRK_A IC_401_3_EXPOSE, IC_401_3_P_LIMIT, IC_401_IC_211_CLK, IC_401_INT_REQ YAW MOTOR FOCUS MOTOR ZOOM MOTOR S003 ZOOM RESET SENSOR FOCUS RESET SENSOR HALL ELEMENT LENS TEMP SENSOR HALL ELEMENT OPTICAL IMAGE STABILIZER XDIRECT_PB KEY_AD0_A KEY_AD_0 XPWR_ON XDIRECT_PB XPWR_ON BACKUP_VDD, XPWR_ON, XDIRECT_PB S001, S002, S004-S006 08 XCHG_LED XUSB_LED XUSB_LED D002 SENS_DATA_P0 - SENS_DATA_P9, SENS_DATA_M0 - SENS_DATA_M9, SENS_CLK_P/M IMGR_RST XHS, XVS IC_211_SDI/SDO, SCK, XCE DOAP - DOJP, DOAM - DOJM, DCKP, DCKM CN401 IRIS_A/XA/B/XB PITCH_HALL+/-, PITCH_BIAS- ZOOM_A/XA/B/XB YAW+/- YAW_HALL+/-, YAW_BIAS- FC_SENS XFC_RST_LED PITCH+/- LENS_TEMP FC_BRK_A FC_DIR_A XZM_RST_LED ZM_SENS_1ST FOCUS_A/XA/B/XB FOCUS_B/XB ZM_SENS_1ST, XZM_RST_LED, FC_SENS, XFC_RST_LED, LENS_TEMP FOCUS_ A/XA FOCUS MOTOR DRIVE (7/8) IC403 OIS DRIVE, IRIS/ZOOM/FOCUS MOTOR DRIVE (7/8) IC401 CN001 (1/2) CN705 (1/2) CD-843 FLEXIBLE BOARD (1/2) CN705 (2/2) CD-843 FLEXIBLE BOARD (2/2) HC-017 FLEXIBLE BOARD CMOS IMAGER CP101 K1, L2 Y26, Y25 AC22 J7 H7 AC25 4 1 3 J3 OSC_CLK_OUT 72M_CLK_OUT M1 IMGR_RST SENS_HD/VD SENS_SI/SO/SCK/XCS AH2 E28 AF4 D1 F5 12M 13, 15 12, 11, 9, 8 39, 40, 42, 43 16 7 46,44,42,38,40,26,34,28,30,32,45, 43,41,37,39,25,33,27,29,31,36,35 38, 36 35 44 25,23,21,19,17,13,11,9,7,5,26, 24,22,20,18,14,12,10,8,6,15,16 CPU, CAMERA DSP, AV SIGNAL PROCESS, LENS CONTROL, MODE CONTROL, HDMI PROCESS (4/8 - 6/8) IC211 X211 72MHz IC_401_SI/SO/SCK, XCS_IC_401 ST-285 BOARD D002 T001 XE_A XE_K FLASH/ CHARGE CONTROL IC001 Q003 FLASH DRIVE CN756 D752 TH251 CN004 FLASH UNIT RL-106 FLEXIBLE BOARD D008 + SELF-TIMER, SMILE SHUTTER, AF ILLUMINATOR ST_UNREG C901 CHARGING CAPACITOR D702 (MS ACCESS) 8 4 6 5 7 STRB_CHG XSTRB_FULL STRB_CHG_CONT STRB_ON STRB_CHG XSTRB_FULL STRB_CHG_CNT STRB_ON XAF_LED STRB_CHG XSTRB_FULL STRB_CHG_CONT STRB_ON XAF_LED XMS_ACC_LED XAF_LED XAF_LED, BACKUP_VDD STRB_CHG, XSTRB_FULL, STRB_CHG_CNT, STRB_ON 11 6 23 13 10 25 KEY_AD0_B 26 24 27 16 8 7 9 XPWR_LED XPOWER_LED KEY_AD_0, XAE_LOCK_SW, XSHUT_SW, XPOWER_LED, 15 BT001 LITHIUM BATTERY CN753 CN751 BACKLIGHT 3.0 INCH WIDE COLOR LCD TOUCH PANEL LCD901 (LCD MODULE) 34 - 57 3, 4 4, 2 5 2 33 31 32 60 61 LCD_HS LCD_VS LCD_CLK_OUT 5 I2C_SDA, I2C_SCK 1, 2 SP+/- SP901 (SPEAKER) SP+/- CAP_TP_INT I2C_SDA, I2C_SCK, CAP_TP_INT XCS_LCD BL_H BL_L AV_SI, AV_SO, AV_SCK XCS_AUDIO XCS_AUDIO IC_211_I2S_SDI0/SDO, IC_211_I2S_BCLK/WCLK, IC_211_AUDIO_MCLK AV_SI, AV_SO, AV_SCK AV_SI, AV_SO, AV_SCK LCD_HS LCD_VS LCD_CLK_OUT XCS_LCD XSYS_RESET AV_SO, AV_SCK CN701 CN704 D705 D706 12, 14 11, 13 19 7 21,23,1, 3,15,6 10,8,11, 16,17,7 14 CN702 16,20,24, 14,18,22 12, 10 4 5 8 1 16 10 21 LINEOUT_L 23 LINEOUT_R XPWR_ON XPWR_ON 6 BATT_UNREG 17 6 USB_ID XAV_JACK_IN USB_VBUS USB_VBUS_DET ST_UNREG, REG_UNREG COMPO_VIDEO COMPO_VIDEO XCS_DD XRESET_REQ CRADLE_UO/UI 2, 4 ACV_UNREG MC_USB_DP, MC_USB_DM USB_ID, XAV_JACK_IN, CRADLE_UO/UI USB_DP, USB_DM SD_DAT0 - SD_DAT3, SD_CLK/CMD MSX_D0 - MSX_D3, MSX_CLK/BS SD_DAT0 - SD_DAT3, SD_CLK/CMD MSX_D0 - MSX_D3, MSX_CLK/BS XEXT_IN XMS_IN XMS_IN, XEXT_IN TE0_XSDCD MSX_INS_HIZ_MPU TE0_SDWP TE0_SDWP HDMI_DATA0P-DATA2P, HDMI_DATA0N - DATA2N HDMI_CLOCKP/CLOCKN HDMI_SDA HDMI_SCL HDMI_CEC HDMI_CLOCKP/CLOCKN HDMI_SDA HDMI_SCL HDMI_CEC HPD HPD MIC_IN_L MIC101 (MICROPHONE) (L) CN001 8, 9, 5, 6, 2, 3 11, 12 16 15 14 19 TMDS_DATA0+/- - TMDS_DATA2+/- TMDS_CLOCK+/- DDCSDA DDCSCL CEC HPD HDMI BATT_SIG BATT_GND BT-066 FLEXIBLE BOARD BATT_UNREG CN706 S BT901 BATTERY TERMINAL BATT_SIG BATT_SIG BATT_UNREG 7 - 10 1 - 5 Q211 LEVEL SHIFT Q212 LEVEL SHIFT PROGRAMMABLE BATTERY CHARGER (2/8) IC051 VBUS OVER CURRENT DETECT (2/8) IC056 FRONT CONTROL, AUDIO AMP (3/8) IC101 C3 MIC_IN_R USB_SEL MIC102 (MICROPHONE) (R) X101 32.768kHz E1 D1 USB SWITCH (2/8) IC052 DC/DC CONVERTER (1/8) IC001 E5 : VIDEO SIGNAL : VIDEO/AUDIO SIGNAL : AUDIO SIGNAL CN001 (2/2) PITCH_AD YAW_AD BL_H/L LCD_R_D0 - D7, LCD_G_D0 - D7, LCD_B_D0 - D7, LCD_R_D0 - D7, LCD_G_D0 - D7, LCD_B_D0 - D7, HDMI_DATA0P-DATA2P, HDMI_DATA0N - DATA2N MICBIAS_L MICBIAS_R D251 I2C_SDA/SCK USB_SEL MEMORY STICK PRO DUO SD 49, 50

DSC-TX20_L3 4-2E 4-2. POWER BLOCK DIAGRAM ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located. FOCUS MOTOR DRIVE (7/8) CLOCK GENERATOR (4/8) SY-333 BOARD ACV_UNREG CN701 BATT_SIG BATT_GND BATT_SIG BT-066 FLEXIBLE BOARD BATT_UNREG BATT_UNREG BATT_UNREG CN706 USB_VBUS XPWR_ON EVER_VDD BATT_A/B ST_UNREG REG_UNREG S BT901 BATTERY TERMINAL MULTI CONNECTOR 6 7 - 10 1 - 5 6 2, 4 7 10 SYS_A/B A3,B3 USB_A/B A5,B5 A4,B4 PROGRAMMABLE BATTERY CHARGER (2/8) IC051 DC/DC CONVERTER (1/8) IC001 IN OUT VBUS OVER CURRENT DETECT (2/8) IC056 F050 C1,C2 F053 F052 F001 PVCC3 A4 LX3 A5 IN3 B4 LDOEN D5 PVCC2 D1 PVCC6 F8 MINE6 E7 PVCC7 H5 VCC E3 PVCC1 A3 PVCC4 E8 L001 L006 LX2 C1 IN2 D2 L003 Vdd 4 Vout A_1.1V DDR_1.8V 1 1.1V REG (1/8) IC003 USB SWITCH (2/8) IC052 Q002, Q003 CE 3 Vdd 4 Vout 1 CE 3 Vdd 4 Vout DDR_1.2V DD_1.2V LX1 A2 IN1 B3 L002 D002 D_VID VIN2 D3 XSYS_RESET E5 RESET_N D1 MS_PWR_ON B6 AUX_PWR_ON B5 XCTL XSYS_RESET XWAKE DDR_1.2V B2 VOUT2 C3 EVER_VDD BACKUP_VDD VO4 B7 LX8 H4 OVP8 F4 VL8 G5 PWM8 E6 IN4 C7 AUX_PSW A7 MS_PSW A8 DD_3.1V 1 1.2V REG (1/8) IC005 Q001 CE 3 1.2V SWITCH 1.8V SWITCH A_1.8V DD_1.8V LX5 H1 PSWOUT5 F1 L005 VDD 4 VOUT HDMI_5.0V HDMI_5V_ON 1 5.0V REG (1/8) IC004 CPU, CAMERA DSP, AV SIGNAL PROCESS, LENS CONTROL, MODE CONTROL, HDMI PROCESS (4/8 - 6/8) IC211 CE 3 VDD 4 VOUT 3 2.8V REG (7/8) PITCH/YAW SENSOR (7/8) SE001 PANEL OPEN/CLOSE DETECT SE101 IC_401_2.8V DD_3.1V DD_1.2V MT_5.0V IC402 IC403 IC213 OIS DRIVE, IRIS/ZOOM/FOCUS MOTOR DRIVE (7/8) IC401 CE 1 MT_5.0V MS_VCC MS_VCC BL_H BL_L CABC_PWM EXT_VCC EXT_VCC EXT_VCC D001 XINT_CHG GPIO_SB_4 H23 USB_CUR_LIM TPU5_OUT AC9 XUSB_PWR_EN BEEP_PWM_P J22 USB_VBUS_IC_211 USB_VBUS AE20 14 23 10 RL-106 FLEXIBLE BOARD (1/2) CN756 (1/2) S002 ON/OFF ON/OFF XPWR_ON BACKUP_VDD DD_3.1V BT001 LITHIUM BATTERY 17 D002 (CHARGE) USB_VBUS_DET ST-285 BOARD D002 T001 L001 CONTROL FLASH/CHARGE IC001 C901 CHARGING CAPACITOR CN756 (2/2) CN004 FLASH UNIT RL-106 FLEXIBLE BOARD (2/2) D008 + SELF-TIMER, SMILE SHUTTER, AF ILLUMINATOR CN001 CD-843 FLEXIBLE BOARD CMOS IMAGER CP101 CN705 CN753 L702 DD_3.1V DD_1.8V XSYS_RESET D_LGC_1.2V IO_1.8V 2.9V REG CE VDD Vout A_2.9V A_3.1V LDO_CONT IC001 5 1, 2 17, 18 21, 22 11, 12 DD_1.2V LVDS_1.8V A_3.1V 46 49, 50 33, 34 29, 30 9 3 ST_UNREG D_3.1V_ST M_5.0V D_3.1V_ST M_5.0V 18 - 21 12 5 1 4 3 ST_UNREG DD_3.1V MT_5.0V CN704 19 12 CN401 9 13 39 19 Z_PI_A F_PI_A BACKLIGHT 3.0 INCH WIDE COLOR LCD TOUCH PANEL LCD901 (LCD MODULE) A_3.1V CN702 2 HDMI_5.0V HDMI_5V 60 10, 22 61 5 30 29 CN751 6 LENS BLOCK 18 HDMI DDR_1.8V DD_1.8V A_3.1V DD_3.1V A_1.8V A_1.1V EXT_VCC D_VID FB351 XUSB_PWR_ON EVER_VDD XPWR_ON2 G3 XPWR_ON4 F4 XPWR_ON1 E3 UNREG E2 FRONT CONTROL, AUDIO AMP (3/8) IC101 BACKUP_VDD DD_1.8V DD_3.1V IC_401_2.8V REG_UNREG XPWR_OFF D4 BACKUP_VDD D3 UNREG_MON F2 XPWR_OFF BATT_SENS XSYS_RESET C3 XSYS_RESET XWAKE F1 XWAKE ACV_DET C2 ACV_DET nIRQ E1 USB_VBUS_IC_211 TH051 THM E2 GPIO_SB_1 F25 ADC0_IN9 H15 GPIO_S_6 G23 MS_PWR_ON FRC_RTG_IN1 AD4 SD_PWR_ON FRC_RTG_OUT2 AD5 HDMI_5V_ON LCD_CABC_PWM H8 CABC_PWM XRESET AF4 XSYS_RESET 08 D702 (MS ACCESS) HC-017 FLEXIBLE BOARD CN001 DD_3.1V BL_H BL_L XSYS_RESET 1.8V REG (1/8) IC006 USB_VBUS_DET REG_GND LDO_EN USB_CUR_LIM XUSB_PWR_EN IBUS_DEF A1 nSTDB_EN_HW C4 Q052 USB CURRENT LIMIT SWITCH, USB POWER ENABLE SWITCH A1-A3,B1,B2 ADC0_IN0 A18 D251 BATT_SIG IC_401_2.8V D053 Q055 UNREG SWITCH XINT_CHG XUSB_PWR_ON nENU_EN_HW B1 Q058 USB SWITCH LDO_EN VBAT C1 BATT_UNREG MEMORY STICK PRO DUO SD ACV_DET

DSC-TX20_L3 5-1E 5. FRAME SCHEMATIC DIAGRAMS CN001 1 25 1 19 23 22 21 20 1 29 1 12 1 10 S001 S002 S003 S004 S005 S006 2 50 1 49 53 51 54 52 CP101 (Not supplied) CN001 49 50 53 54 52 51 CN705 1 2 CN401 2 1 38 39 CN756 1 2 28 29 1 10 12 11 CN706 CN753 60 61 1 2 1 2 24 25 CN702 1 7 6 8 CN751 25 26 2 23 1 24 CN701 28 27 16 1 CN704 SY-333 BOARD (SIDE B) BT-066 FLEXIBLE BOARD SY-333 BOARD (SIDE A) CD-843 FLEXIBLE BOARD SP901 (SPEAKER) MIC101 (MICROPHONE) (L) MIC102 (MICROPHONE) (R) SP- SP+ LITHIUM BATTERY BT001 RL-106 FLEXIBLE BOARD (PLAYBACK) (RELEASE) (MOVIE) W T (ZOOM) ON/OFF HC-017 FLEXIBLE BOARD HDMI LCD901 (LCD MODULE) 3.0 INCH WIDE COLOR LCD BACKLIGHT TOUCH PANEL IC211 (Not supplied) BT901 BATTERY TERMINAL CN004 ( ) C901 CHARGING CAPACITOR FLASH UNIT (FL61800) ST-285 BOARD (SIDE A) ST-285 BOARD (SIDE B) 1 12 13 14 ( ) MULTI CONNECTOR SE001 (PITCH/YAW) LENS BLOCK +

6-1 DSC-TX20_L3 6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS – ENGLISH – – JAPANESE – THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS. (In addition to this, the necessary note is printed in each block.) For Schematic Diagrams • All capacitors are in μF unless otherwise noted. pF : μ μF. 50 V or less are not indicated except for electrolytics and tantal- ums. • Chip resistors are 1/10 W unless otherwise noted. kΩ=1000 Ω, MΩ=1000 kΩ. • Caution when replacing chip parts. New parts must be attached after removal of chip. Be careful not to heat the minus side of tantalum capacitor, Because it is damaged by the heat. • Some chip part will be indicated as follows. Example C541 L452 22U 10UH TA A 2520 Kinds of capacitor External dimensions (mm) Case size • Constants of resistors, capacitors, ICs and etc with XX indicate that they are not used. In such cases, the unused circuits may be indicated. • Parts with ★ differ according to the model/destination. Refer to the mount table for each function. • All variable and adjustable resistors have characteristic curve B, unless otherwise noted. • Signal name XEDIT → EDIT PB/XREC → PB/REC • : non flammable resistor • : fusible resistor • : panel designation • : B+ Line • : B– Line • : IN/OUT direction of (+, –) B LINE. • : adjustment for repair. For Printed Wiring Boards • : Uses unleaded solder. • : Circuit board : Flexible board Pattern from the side which enables seeing. : pattern of the rear side (The other layers’ patterns are not indicated) • Through hole is omitted. • There are a few cases that the part printed on diagram isn’t mounted in this model. • : panel designation • Chip parts. Transistor Diode 2 1 3 2 1 3 2 1 3 3 4 5 2 1 1 2 3 6 5 4 E B C 3 1 5 2 4 6 1 2 3 6 5 4 3 1 5 2 4 6 1 2 3 5 4 4 3 1 2 3 12 4 5 5 34 1 2 1 4 2 3 4 6 2 5 3 1 1 2 4 3 1 4 2 3 Precautions for Replacement of Imager • If the imager has been replaced, carry out all the adjustments for the camera section. • As the imager may be damaged by static electricity from its structure, handle it carefully like for the MOS IC. In addition, ensure that the receiver is not covered with dusts nor exposed to strong light. When indicating parts by reference number, please include the board name. The components identified by mark or dotted line with mark are critical for safety. Replace only with part number specified. Les composants identifiés par une marque sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. 回路図，プリント図共通ノート（他に必要なノートは各セクションに記載しています）回路図ノート・ケミコン，タンタルを除くコンデンサで，耐圧50V以下のものはその耐圧を省略。単位はすべてμF（pはpF）。・チップ抵抗で指示のないものは，1/10W以下。 kΩ＝1000Ω，MΩ＝1000kΩ ・チップ部品交換時の注意取り外した部品は再使用せず，未使用の部品をご使用ください。タンタルコンデンサのマイナス側は熱に弱いため注意してください。・チップ部品には下記のように表示したものがあります。例 C541 L452 22U 10UH TA A 2520 種類　　　　　　外形寸法（mm）ケースサイズ・抵抗，コンデンサ，ICなど定数にXXがあるものは，使用していない事を示しています。このため，使用していない回路が記載されている事があります。・ ★印のある部品は，機種などにより異なりますので機能別マウント一覧表を参照してください。・可変抵抗と半固定抵抗で，B特性の表示を省略。・信号名表記について，下記のような場合があります。 XEDIT　→　EDIT　　　　PB/XREC　→　PB/REC ・は不燃性抵抗。・はヒューズ抵抗。・はパネル表示名称。・はB＋ライン。・はB－ライン。・はBライン（＋，－）の入出力方向を示す。・は調整名称。プリント図ノート・：無鉛半田を使用しています。・：基板：フレキシブル配線板見ている面側のパターン。：裏側のパターン（他のパターンについては表示されていません）・スルーホールは省略。・プリント図には，本機で使用していない部品が記載されている場合があります。・はパネル表示名称。 • Chip parts. Transistor　　　　　　　　　　Diode 2 1 3 2 1 3 2 1 3 3 4 5 2 1 1 2 3 6 5 4 E B C 3 1 5 2 4 6 1 2 3 6 5 4 3 1 5 2 4 6 1 2 3 5 4 4 3 1 2 3 12 4 5 5 34 1 2 1 4 2 3 4 6 2 5 3 1 1 2 4 3 1 4 2 3 イメージャ交換時の注意・イメージャを交換した場合は，カメラ部の全調整を行ってください。・イメージャは構造上，静電気により破壊される恐れがあるため，MOS ICと同様に注意して取り扱ってください。また，受光部にはゴミの付着，および強い光がはいることのないように注意してください。図面番号で部品を指定するときは基板名又はブロックを併せて指定してください。お願い印の部品，または印付の点線で囲まれた部品は，安全性を維持するために，重要な部品です。従って交換時は，必ず指定の部品を使用してください。

6-2 DSC-TX20_L3 6-1. SCHEMATIC DIAGRAMS SY-333 (8/8) CN705 (PAGE 6-10) Note: All mounted parts are not supplied, but they are included in CD-843 FLEXIBLE COMPLETE BOARD. Note: SP901 is not included in CD-843 FLEXIBLE COMPLETE BOARD. 1 2 3 4 5 6 7 8 9 A B C D E F A B C D E F 08 CD-843 FLEXIBLE BOARD CMOS IMAGER XX MARK: NO MOUNT DOAM DOAP DOBM DOBP DOCM DOCP DODM DODP DOEM DOEP DOFM DOFP DOGM DOGP DOHM DOHP DOIM DOIP DOJM DOJP DCKM DCKP LDO_CONT A_2.9V XHS IMGR_RST DOAM SP- DOBM DOCM DOEM DODM DCKM DOGM DOJM DOIM DOHM DOFM XVS XHS IC_211_SDO SCK IMGR_RST LDO_CONT OSC_CLK_OUT SP+ DOAP DOBP DOCP DOEP DODP DCKP DOGP DOJP DOIP DOHP DOFP XCE IC_211_SDI REG_GND XVS IC_211_SDO IC_211_SDI SCK XCE A_3.1V D_LGC_1.2V D_LGC_1.2V IO_1.8V IO_1.8V C006 0.1u C008 4.7u C009 4.7u C012 0.001u C013 0.1u C007 1u CP101 ASM083MR-TA-A A1 NC A3 NC H1 VDDLSC1 H14 VDDLSC2 H2 VSSLSC1 H3 VSSLSC1 H12 VSSLSC2 H13 VSSLSC2 G1 VDDLCN1 G14 VDDLCN2 G2 VSSLCN1 G3 VSSLCN1 G12 VSSLCN2 G13 VSSLCN2 F2 VSSLCB1 F3 VSSLCB1 F12 VSSLCB2 F13 VSSLCB2 A4 NC A12 NC A14 NC B3 NC B12 NC C1 NC C2 NC D2 TOUT D4 TSCANEN D3 TENABLE K1 XHS L2 XVS K4 SDI J4 SDO K3 SCK J2 XCE J3 XCLR J1 VDDMIO C3 NC C6 NC C7 NC C8 NC C9 NC C12 NC A6 VDDHCP B5 VSSHCP C10 VBGR C11 VEXRES A11 VDDHDA B11 VSSHDA D11 ASMON1 D12 ASMON2 B8 VLOADLM A8 VDDHPX A7 VSSHPX B6 VSSHPX B7 VSSHPX A9 VSSHPX B9 VSSHPX B10 VSSHPX A10 VDDHCM C4 VRLS C5 VRLT A5 VDDHVS B4 VSSHVS D1 VDDSUBD1 D14 VDDSUBD2 C13 NC C14 NC D5 NC D6 NC D7 NC D8 NC D9 NC D10 NC D13 NC E1 NC E2 NC E3 NC E4 NC L1 VDDLPL M2 VSSLPL M1 INCK E11 NC E12 NC E13 NC E14 NC F1 NC F4 NC F11 NC F14 NC G4 NC G11 NC H4 NC H11 NC J11 NC J12 NC J13 NC J14 NC K2 NC K11 NC K12 NC K13 NC K14 NC L3 NC L4 NC L11 NC L12 NC L13 NC L14 NC M3 NC M4 NC M5 NC M10 NC M11 NC M12 NC M13 NC M14 VFUSE R4 DOAM P4 DOAP R5 DOBM P5 DOBP N4 DOCM N5 DOCP R6 DODM P6 DODP N7 DOEM N6 DOEP N9 DOFM N8 DOFP R8 DOGM P8 DOGP N10 DOHM N11 DOHP R9 DOIM P9 DOIP R10 DOJM P10 DOJP P7 DCKM R7 DCKP N1 NC N2 NC N3 NC N12 NC M6 VDDMLV M7 VDDMLV M8 VSSMLV M9 VSSMLV N13 NC N14 NC P3 NC P11 NC P12 NC R1 NC R3 NC R11 NC R12 NC R14 NC C011 0.1u C024 0.1u C023 0.1u R007 47k C022 1u C021 1u C020 4.7u C019 1u C017 2.2u R008 XX R009 XX C018 2.2u C016 2.2u C014 0.1u C001 1u C002 22u 6.3V C010 XX IC001 RP103K281D 1 Vout 2 GND 3 CE 4 VDD 5 C004 1u R011 XX CL008 R010 XX C025 XX X001 XX 1 4 3 2 C015 XX C005 0.001u LND001 SP+ LND002 SP- R001 XX R005 XX R006 XX CL001 XHS CL002 XVS CL003 IC_211_SDO CL004 IC_211_SDI CL005 SCK CL006 SCK CN001 50P 1 A_3.1V 3 REG_GND 5 LDO_CONT 7 IMGR_RST 9 SCK 11 IC_211_SDO 13 XHS 15 XVS 17 D_LGC_1.2V 19 REG_GND 21 IO_1.8V 23 REG_GND 25 DOFM 27 DOHM 29 DOIM 31 DOJM 33 DOGM 35 DCKM 37 DODM 39 DOEM 41 DOCM 43 DOBM 45 DOAM 47 REG_GND 49 SP- 2 A_3.1V 4 REG_GND 6 REG_GND 8 XCE 10 REG_GND 12 IC_211_SDI 14 REG_GND 16 OSC_CLK_OUT 18 D_LGC_1.2V 20 REG_GND 22 IO_1.8V 24 REG_GND 26 DOFP 28 DOHP 30 DOIP 32 DOJP 34 DOGP 36 DCKP 38 DODP 40 DOEP 42 DOCP 44 DOBP 46 DOAP 48 REG_GND 50 SP+ 51 52 53 54 (SPEAKER) SP901 2.9V REG CMOS IMAGER

Sony Cyber Shot DSC-TX20 Service Manual & Repair Guide

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