LG 47LM640S-ZA 47LM640T-ZA LED LCD TV Service Manual
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Printed in Korea P/NO : MFL67360921 (1206-REV00)
CHASSIS : LD22E
MODEL : 47LM640S/640T
MODEL : 47LM640S/640T-ZA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED LCD TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
- 2 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS.................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM.................................................................................. 18
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
- 3 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
- 4 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity suf-
ficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
- 5 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to the LCD TV used LD22E
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
- Wireless : Wireless HD Specification (Option)
4. Model General Specification
No. Item Specification Remarks
1 Market EU(PAL Market-36Countries)
DTV & Analog (Total 37 countries)
DTV (MPEG2/4, DVB-T) : 30 countries
Germany, Netherland, Switzerland, Hungary, Austria,
Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia,
Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire-
land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania,
Albania, Bosnia, Serbia, Slovakia, Beralus
DTV (MPEG2/4, DVB-T2) : 7 countries
UK, Sweden, Denmark, Finland, Norway, Ukraine, Kaza-
khstan, Ireland
DTV (MPEG2/4, DVB-C) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria,
Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia,
Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire-
land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania,
Albania, Bosnia, Serbia, Slovakia, Beralus, UK, Sweden,
Denmark, Finland, Norway, Ukraine, Kazakhstan
DTV (MPEG2/4,DVB-S) : 30 countries
Germany, Netherland, Switzerland, Hungary, Austria,
Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia,
Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire-
land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania,
Albania, Bosnia, Serbia, Slovakia, Beralus
Supported satellite : 22 satellites
HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102,
ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EU-
TELSAT-W3A, EUROBIRD 9°, EUTELSAT-W2A, HOTBIRD
6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA
3°/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT-
W7, HELLASSAT 2, EXPRESS AM1, TURKSAT 2°/3°,
INTERSAT10
- 7 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Item Specification Remarks
2 Broadcasting system
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’, DK, BG, I
5) DVB-T
6) DVB-C
7) DVB-T2
8) DVB-S
DVB-S: Satellite
3 Receiving system
Analog : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation :
16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
4 Scart Gender Jack (1EA) PAL, SECAM
Scart jack is Full scart and support MNT/DTV-OUT
(not support DTV Auto AV)
5 Video Input RCA(1EA) PAL, SECAM, NTSC
4 System : PAL, SECAM, NTSC, PAL60
AV gender jack 1EA
6 Head phone out
Antenna, AV1, AV2, Component,
RGB, HDMI1, HDMI2, HDMI3,
HDMI4, USB1, USB2, USB3
7 Component Input (1EA)
Y/Cb/Cr
Y/Pb/Pr
Component Gender 1EA
8 RGB Input RGB-PC Analog(D-SUB 15PIN)
9 HDMI Input (4EA)
HDMI1-DTV
HDMI2-DTV
HDMI3-DTV
HDMI4-DTV
HDMI4 : PC support(HDMI version 1.3)
Support HDCP
10 Audio Input (3EA)
RGB/DVI Audio
Component
AV
L/R Input
11 SPDIF out (1EA) SPDIF out
12 USB (3EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD
13 Ethernet Connect(1EA) Ethernet Connect
- 8 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. Component Video Input (Y, Cb/Pb, Cr/Pr)
6. RGB input (PC)
No. Resolution H-freq(kHz) V-freq(Hz) Porposed
1 720×480 15.73 60.00 SDTV, DVD 480i
2 720×480 15.63 59.94 SDTV, DVD 480i
3 720×480 31.47 59.94 480p
4 720×480 31.50 60.00 480p
5 720×576 15.625 50.00 SDTV, DVD 625 Line
6 720×576 31.25 50.00 HDTV 576p
7 1280×720 45.00 50.00 HDTV 720p
8 1280×720 44.96 59.94 HDTV 720p
9 1280×720 45.00 60.00 HDTV 720p
10 1920×1080 31.25 50.00 HDTV 1080i
11 1920×1080 33.75 60.00 HDTV 1080i
12 1920×1080 33.72 59.94 HDTV 1080i
13 1920×1080 56.250 50 HDTV 1080p
14 1920×1080 67.5 60 HDTV 1080p
No. Resolution H-freq(kHz) V-freq.(Hz) Proposed
1 640 x 350 @70Hz 31.468 70.09 EGA
2 720 x 400 @70Hz 31.469 70.08 DOS
3 640 x 480 @60Hz 31.469 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.879 60.31 VESA(SVGA)
5 1024 x 768 @60Hz 48.363 60.00 VESA(XGA)
6 1152 x 864 @60Hz 54.348 60.053 VESA
7 1360 x 768 @60Hz 47.712 60.015 VESA(WXGA)
8 1920 x 1080 @60Hz 67.5 60.00 WUXGA(Reduced Blanking))
- 9 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. HDMI Input
7.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(kHz) Proposed
1. 640*480 31.469 / 31.5 59.94/60 SDTV 480P
2. 720*480 31.469 / 31.5 59.94 / 60 SDTV 480P
3. 720*576 31.25 50 SDTV 576P
4. 720*576 15.625 50 SDTV 576I
5. 1280*720 37.500 50 HDTV 720P
6. 1280*720 44.96 / 45 59.94 / 60 HDTV 720P
7. 1920*1080 33.72 / 33.75 59.94 / 60 HDTV 1080I
8. 1920*1080 28.125 50.00 HDTV 1080I
9. 1920*1080 26.97 / 27 23.97 / 24 HDTV 1080P
10. 1920*1080 25 HDTV 1080P
11. 1920*1080 33.716 / 33.75 29.976 / 30.00 HDTV 1080P
12. 1920*1080 56.250 50 HDTV 1080P
13. 1920*1080 67.43 / 67.5 59.94 / 60 HDTV 1080P
No. Resolution H-freq(kHz) V-freq.(Hz) Proposed
1 640 x 350 @70Hz 31.468 70.09 EGA
2 720 x 400 @70Hz 31.469 70.08 DOS
3 640 x 480 @60Hz 31.469 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.879 60.31 VESA(SVGA)
5 1024 x 768 @60Hz 48.363 60.00 VESA(XGA)
6 1152 x 864 @60Hz 54.348 60.053 VESA
7 1280 x 1024 @60Hz 63.981 60.020 VESA(SXGA)
8 1360 x 768 @60Hz 47.712 60.015 VESA(WXGA)
9 1920 x 1080 @60Hz 67.5 60.00 WUXGA(Reduced Blanking))
7.2. PC mode
- 10 -
LGE Internal Use Only Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED LCD TV
with LD22E chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. Automatic Adjustment
3.1. ADC Adjustment
3.1.1. Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
3.1.2. Equipment & Condition
(1) USB to RS-232C Jig
(2) MSPG-925 Series Pattern Generator(MSPG-925FA,
pattern - 65)
- Resolution : 1080P Comp1
1920*1080 RGB
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7 ± 0.1 Vp-p
- Image
3.1.3. Adjustment
(1) Adjustment method
▪ Don’t need to adjust ADC because there is data in OTP
and adjusted initially.
▪ Check ADC adjustment
1) Press In start key on the Adj. Remote Control, then
Adjust ADC(OTP) status is displayed on “1.Adjustment
check”. Select “2.ADC Data”, then ADC data is
displayed.
2) Press Adj. key on the Adjustmetn Remote Control, and
select “9.ADC Calibration”. Set up the ADC Type to
OTP, then Select [Start] button by pressing Enter key,
Component and RGB are Writed and display Success
or NG.
(2) Adj. protocol
Ref.) ADC Adj. RS232C Protocol_Ver1.0
(3) Adj. order
- aa 00 00 [Enter ADC adj. mode]
- xb 00 04 [Change input source to Component1 (480i&
1080p)]
- ad 00 10 [Adjust 480i&1080p Comp1]
- xb 00 06 [Change input source to RGB(1024*768)]
- ad 00 10 [Adjust 1920*1080 RGB]
- ad 00 90 End adj.
Protocol Command Set ACK
Enter adj. mode aa 00 00 a 00 OK00x
Source change
xb 00 04 b 00 OK04x (Adjust 480i, 1080p Comp1 )
xb 00 06 b 00 OK06x (Adjust 1920*1080 RGB)
Begin adj. ad 00 10
Return adj. result
OKx (Case of Success)
NGx (Case of Fail)
Read adj. data
(main)
ad 00 20
(main)
000000000000000000000000007c007b006dx
(sub )
(Sub)
000000070000000000000000007c00830077x
ad 00 21
Confirm adj. ad 00 99
NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj. aa 00 90 a 00 OK90x
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This service manual for the LG 47LM640S-ZA 47LM640T-ZA LED LCD TV, with chassis LD22E, is a comprehensive guide for repair and maintenance. It includes safety precautions, servicing precautions, specifications, adjustment instructions, block diagrams, exploded views, and schematic circuit diagrams. The manual is in English and spans 118 pages, available in PDF format for use on Windows and MAC platforms.
